Guo Rui, Su Jie, Zhang Pengliang, He Fuchao, Lin Zhenhua, Zhang Jincheng, Chang Jingjing, Hao Yue
State Key Discipline Laboratory of Wide Band Gap Semiconductor Technology, Shaanxi Joint Key Laboratory of Graphene, Advanced Interdisciplinary Research Center for Flexible Electronics, School of Microelectronics, Xidian University, 2 South Taibai Road, Xi'an 710071, People's Republic of China.
Nanotechnology. 2020 Nov 27;31(48):485204. doi: 10.1088/1361-6528/abafdb.
Modulating the n- and p-type interfacial charge transport properties of the metal-semiconductor interface is vital to realizing high performance two-dimensional material nanodevices and is still a significant challenge. Here, a boron nitride (BN)-graphene lateral heterostructure (LH) was used as the interfacial tunneling layer to control the Schottky barrier, Fermi level pinning and charge injection efficiency of the metal-MoS interface. The BN-graphene LH with graphene-N junction structure decreased the n-type vertical Schottky barrier and enhanced the interfacial tunneling probability, while the graphene-B junction structure decreased the p-type vertical Schottky barrier. Consequently, the n-type Au/LH-MoS interface with Ohmic character and high tunneling probability (∼0.242) and the p-type vertical Schottky barrier of about 0.20 eV for the Pt/LH-MoS interface were achieved. Compared to other reported BN or graphene tunneling layers, such a BN-graphene LH tunneling layer not only suppressed the charge scattering from the metal electrode to the MoS layer and the Fermi level pinning effect, but also reduced the contact resistance between metal electrode and tunneling layer. The underlying mechanisms were revealed to be due to the charge transfer, orbitals and interfacial dipole. This work improves the current understanding of the metal-MoS interface and proposes a new way to overcome the current severe contact issues for future nanoelectronic and optoelectronic applications.
调控金属-半导体界面的n型和p型界面电荷传输特性对于实现高性能二维材料纳米器件至关重要,且仍然是一项重大挑战。在此,采用氮化硼(BN)-石墨烯横向异质结构(LH)作为界面隧穿层,以控制金属-MoS界面的肖特基势垒、费米能级钉扎和电荷注入效率。具有石墨烯-N结结构的BN-石墨烯LH降低了n型垂直肖特基势垒并提高了界面隧穿概率,而石墨烯-B结结构降低了p型垂直肖特基势垒。结果,实现了具有欧姆特性和高隧穿概率(约0.242)的n型Au/LH-MoS界面以及Pt/LH-MoS界面约0.20 eV的p型垂直肖特基势垒。与其他报道的BN或石墨烯隧穿层相比,这种BN-石墨烯LH隧穿层不仅抑制了从金属电极到MoS层的电荷散射和费米能级钉扎效应,还降低了金属电极与隧穿层之间的接触电阻。其潜在机制被揭示为归因于电荷转移、轨道和界面偶极。这项工作增进了当前对金属-MoS界面的理解,并为未来纳米电子和光电子应用中克服当前严峻的接触问题提出了一种新方法。