热固性聚合物纳米复合材料的特性：含硅氧烷-酰亚胺的苯并恶嗪与倍半硅氧烷环氧树脂

Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins.

作者信息

Lin Chih-Hao, Chen Wen-Bin, Whang Wha-Tzong, Chen Chun-Hua

机构信息

Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 300093, Taiwan.

Material and Chemical Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu 31040, Taiwan.

出版信息

Polymers (Basel). 2020 Oct 28;12(11):2510. doi: 10.3390/polym12112510.

DOI:10.3390/polym12112510

PMID:33126641

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7692388/

Abstract

A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.

摘要

制备了一系列创新的热固性聚合物纳米复合材料，该材料以含聚硅氧烷-酰亚胺的苯并恶嗪（PSiBZ）为基体，以双层倍半硅氧烷（DDSQ）环氧树脂或多面体低聚倍半硅氧烷（POSS）环氧树脂为增强相，用于改善热固性性能。热机械和动态力学表征表明，DDSQ和POSS均可有效降低热膨胀系数，降幅高达约34%，并显著提高储能模量（增幅高达183%）。因此，DDSQ和POSS是用于电子封装应用的低应力封装的有前途的材料。