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用于柔性纺织混合电子器件的织物上丝网印刷银线路上表面贴装器件的低温焊接

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics.

作者信息

Silvestre Rocío, Llinares Llopis Raúl, Contat Rodrigo Laura, Serrano Martínez Víctor, Ferri Josué, Garcia-Breijo Eduardo

机构信息

Textile Research Institute (AITEX), 03801 Alicante, Spain.

Departamento de Comunicaciones, Universitat Politècnica de València, 03801 Alcoy, Spain.

出版信息

Sensors (Basel). 2022 Aug 2;22(15):5766. doi: 10.3390/s22155766.

DOI:10.3390/s22155766
PMID:35957322
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9370845/
Abstract

The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate. Several patterns of different widths and gaps between tracks were tested in order to find the best design parameters for some footprint configurations. With respect to the incorporation of devices on textile substrates, the paper analyzes the soldering of surface mount devices on fabric substrates. Due to the substrate's nature, low soldering temperatures must be used to avoid deformations or damage to the substrate caused by the higher temperatures used in conventional soldering. Several solder pastes used for low-temperature soldering are analyzed in terms of joint resistance and shear force application. The results obtained are satisfactory, demonstrating the viability of using flexible hybrid electronics with fabrics. As a practical result, a simple single-layer circuit was implemented to check the results of the research.

摘要

柔性印刷基板与传统电子器件的结合产生了柔性混合电子器件。当织物用作柔性基板时，会出现两类问题。第一类问题与相应电路走线的印刷有关。第二类问题涉及在纺织基板上集成传统电子器件，如集成电路。关于走线的印刷，这项工作研究了在纺织品上丝网印刷银走线的最佳设计参数，重点是在纺织基板上印刷电子电路。测试了几种不同宽度和走线间距的图案，以便为某些封装配置找到最佳设计参数。关于在纺织基板上集成器件，本文分析了表面贴装器件在织物基板上的焊接。由于基板的性质，必须使用较低的焊接温度，以避免传统焊接中使用的较高温度对基板造成变形或损坏。从接头电阻和剪切力施加方面分析了几种用于低温焊接的焊膏。获得的结果令人满意，证明了使用织物制造柔性混合电子器件的可行性。作为一个实际成果，实现了一个简单的单层电路来检验研究结果。

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