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一种新型压电陶瓷叠堆式智能骨料的设计与分析

Design and Analysis of a Novel Piezoceramic Stack-based Smart Aggregate.

作者信息

Lu Guangtao, Zhu Xin, Wang Tao, Hao Zhiqiang, Tan Bohai

机构信息

Key Laboratory for Metallurgical Equipment and Control of Ministry of Education, Wuhan University of Science and Technology, Wuhan 430081, China.

Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering, Wuhan University of Science and Technology, Wuhan 430081, China.

出版信息

Sensors (Basel). 2020 Nov 11;20(22):6438. doi: 10.3390/s20226438.

Abstract

A novel piezoceramic stack-based smart aggregate (PiSSA) with piezoceramic wafers in series or parallel connection is developed to increase the efficiency and output performance over the conventional smart aggregate with only one piezoelectric patch. Due to the improvement, PiSSA is suitable for situations where the stress waves easily attenuate. In PiSSA, the piezoelectric wafers are electrically connected in series or parallel, and three types of piezoelectric wafers with different electrode patterns are designed for easy connection. Based on the theory of piezo-elasticity, a simplified one-dimensional model is derived to study the electromechanical, transmitting and sensing performance of PiSSAs with the wafers in series and parallel connection, and the model was verified by experiments. The theoretical results reveal that the first resonance frequency of PiSSAs in series and parallel decreases as the number or thickness of the PZT wafers increases, and the first electromechanical coupling factor increases firstly and then decrease gradually as the number or thickness increases. The results also show that both the first resonance frequency and the first electromechanical coupling factor of PiSSA in series and parallel change no more than 0.87% as the Young's modulus of the epoxy increases from 0.5 to 1.5 times 3.2 GPa, which is helpful for the fabrication of PiSSAs. In addition, the displacement output of PiSSAs in parallel is about 2.18-22.49 times that in series at 1-50 kHz, while the voltage output of PiSSAs in parallel is much less than that in parallel, which indicates that PiSSA in parallel is much more suitable for working as an actuator to excite stress waves and PiSSA in series is suitable for working as a sensor to detect the waves. All the results demonstrate that the connecting type, number and thickness of the PZT wafers should be carefully selected to increase the efficiency and output of PiSSA actuators and sensors. This study contributes to providing a method to investigate the characteristics and optimize the structural parameters of the proposed PiSSAs.

摘要

一种新型的基于压电陶瓷叠堆的智能骨料(PiSSA)被开发出来,其压电陶瓷晶片采用串联或并联连接,相较于仅带有一个压电片的传统智能骨料,可提高效率和输出性能。由于这一改进,PiSSA适用于应力波容易衰减的情况。在PiSSA中,压电晶片通过串联或并联方式进行电连接,并且设计了三种具有不同电极图案的压电晶片以便于连接。基于压电弹性理论,推导了一个简化的一维模型,用于研究串联和并联晶片的PiSSA的机电、传输和传感性能,并通过实验对该模型进行了验证。理论结果表明,串联和并联PiSSA的第一共振频率随着PZT晶片数量或厚度的增加而降低,第一机电耦合系数随着数量或厚度的增加先增大后逐渐减小。结果还表明,当环氧树脂的杨氏模量从3.2 GPa的0.5倍增加到1.5倍时,串联和并联PiSSA的第一共振频率和第一机电耦合系数的变化均不超过0.87%,这有助于PiSSA的制造。此外,在1 - 50 kHz频率下,并联PiSSA的位移输出约为串联PiSSA的2.18 - 22.49倍,而并联PiSSA的电压输出远小于串联PiSSA,这表明并联PiSSA更适合用作激发应力波的 actuator,而串联PiSSA适合用作检测波的传感器。所有结果表明,应仔细选择PZT晶片的连接类型、数量和厚度,以提高PiSSA actuator和传感器的效率和输出。本研究有助于提供一种方法来研究所提出的PiSSA的特性并优化其结构参数。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a539/7696589/166c5d8b5c50/sensors-20-06438-g001.jpg

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