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在刚性和柔性衬底上室温制备碳化硅微线光电探测器:飞秒激光直写

Room-temperature fabrication of SiC microwire photodetectors on rigid and flexible substrates femtosecond laser direct writing.

作者信息

Liang Shuyu, Dai Yunzhi, Wang Gong, Xia Hong, Zhao Jihong

机构信息

State Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, 2699 Qianjin Street, Changchun 130012, China.

出版信息

Nanoscale. 2020 Nov 26;12(45):23200-23205. doi: 10.1039/d0nr05299j.

DOI:10.1039/d0nr05299j
PMID:33201169
Abstract

Flexible ultraviolet (UV) photodetectors (PDs) have gained increasing demand because of their widespread applications in wearable devices. However, difficulties associated with complicated fabrication technologies significantly limit their scope of application. Herein, via the development of a femtosecond laser direct writing (FsLDW) strategy, silicon carbide (SiC) nanoparticles are found to be assembled in a single microwire within 30 s. The surface of the deposited SiC microwire presents a three-dimensional porous structure, which is conducive to improving the responsivity of the device. The responsivity of a SiC-based microwire PD to UV light at 365 nm is found to be 55.89 A W-1 at a 1 V bias. The as-fabricated SiC microwire PDs on a glass substrate exhibit thermal stability at 350 °C, and the response speed of the PDs becomes notably faster at high temperatures, suggesting their promising applications in harsh conditions. Due to the low-temperature processing characteristics of this process, they can be prepared not only on glass substrates, but also on thermosensitive polymer substrates without an extra transfer process. Moreover, the SiC microwires prepared via FsLDW are directly deposited on the flexible substrate, and the prepared flexible SiC-based PDs can still work stably after being bent 2000 times. This research unveils a feasible way to fabricate a PD with excellent thermal stability and mechanical flexibility.

摘要

柔性紫外光探测器(PDs)因其在可穿戴设备中的广泛应用而需求日益增加。然而,与复杂制造技术相关的困难显著限制了它们的应用范围。在此,通过飞秒激光直写(FsLDW)策略的发展,发现碳化硅(SiC)纳米颗粒在30秒内组装在单根微丝中。沉积的SiC微丝表面呈现三维多孔结构,这有利于提高器件的响应度。基于SiC的微丝PD在1 V偏压下对365 nm紫外光的响应度为55.89 A W-1。在玻璃基板上制备的SiC微丝PD在350°C下表现出热稳定性,并且PD在高温下的响应速度明显加快,表明它们在恶劣条件下具有广阔的应用前景。由于该工艺的低温处理特性,它们不仅可以在玻璃基板上制备,还可以在热敏聚合物基板上制备,无需额外的转移过程。此外,通过FsLDW制备的SiC微丝直接沉积在柔性基板上,制备的基于SiC的柔性PD在弯曲2000次后仍能稳定工作。这项研究揭示了一种制造具有优异热稳定性和机械柔韧性的PD的可行方法。

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