Ding Xiaochuan, Zhao Yao, Hassan Ali, Sun Yunlu, Hou Zhishan, Xue Wei, Cao Yu
International Science and Technology Cooperation Base for Laser Processing Robot, College of Mechanical and Electrical Engineering, Wenzhou University, Wenzhou 325035, China.
State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China.
Micromachines (Basel). 2022 Jul 21;13(7):1158. doi: 10.3390/mi13071158.
With the rapid increase in information density, problems such as signal crosstalk and crossover restrict the further expansion of chip integration levels and packaging density. Based on this, a novel waveguide structure-photonic jumper wire-is proposed here to break through the technical restrictions in waveguide crossing and parallel line wrapping, which hinder the integration of photonic chips. Furthermore, we fabricated the optical overpass to realize a more complex on-chip optical cross-connection. Our method and structure promote a series of practical schemes for improving optical chip integration.
随着信息密度的迅速增加，诸如信号串扰和交叉等问题限制了芯片集成度和封装密度的进一步提高。基于此，本文提出了一种新型波导结构——光子跨接线，以突破波导交叉和平行线缠绕方面的技术限制，这些限制阻碍了光子芯片的集成。此外，我们制造了光立交桥以实现更复杂的片上光交叉连接。我们的方法和结构推动了一系列用于提高光芯片集成度的实用方案。
