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一种基于差分输出和温度传感器的具有温度补偿方法的谐振压力微传感器。

A Resonant Pressure Microsensor with Temperature Compensation Method Based on Differential Outputs and a Temperature Sensor.

作者信息

Xiang Chao, Lu Yulan, Yan Pengcheng, Chen Jian, Wang Junbo, Chen Deyong

机构信息

State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.

School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.

出版信息

Micromachines (Basel). 2020 Nov 21;11(11):1022. doi: 10.3390/mi11111022.

DOI:10.3390/mi11111022
PMID:33233469
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7700299/
Abstract

This paper presents the analysis and characterization of a resonant pressure microsensor, which employs a temperature compensation method based on differential outputs and a temperature sensor. Leveraging a silicon-on-insulator (SOI) wafer, this microsensor mainly consists of a pressure-sensitive diagram and two resonant beams (electromagnetic driving and electromagnetic induction) to produce a differential output. The resonators were vacuum packaged with a silicon-on-glass (SOG) cap using anodic bonding and the wire interconnection was realized by sputtering an Au film on highly topographic surfaces using a hard mask. After the fabrication of the resonant pressure microsensor, systematic experiments demonstrated that the pressure sensitivity of the presented microsensor was about 0.33 kPa/Hz. Utilizing the differential frequency of the two resonators and the signal from a temperature sensor to replace the two-frequency signals by polynomial fitting, the temperature compensation method based on differential outputs aims to increase the surface fitting accuracy of these microsensors which have turnover points. Employing the proposed compensation approach in this study, the errors were less than 0.02% FS of the full pressure scale (a temperature range of -40 to 85 °C and a pressure range of 200 kPa to 2000 kPa).

摘要

本文介绍了一种谐振式压力微传感器的分析与特性,该传感器采用基于差分输出和温度传感器的温度补偿方法。利用绝缘体上硅(SOI)晶圆,这种微传感器主要由一个压敏图和两个谐振梁(电磁驱动和电磁感应)组成,以产生差分输出。谐振器采用阳极键合技术与玻璃上硅(SOG)帽进行真空封装,并通过使用硬掩膜在高地形表面溅射金膜来实现引线互连。在制造出谐振式压力微传感器后,系统实验表明,所呈现的微传感器的压力灵敏度约为0.33 kPa/Hz。基于差分输出的温度补偿方法利用两个谐振器的差分频率和温度传感器的信号,通过多项式拟合来替代双频信号,旨在提高这些具有转折点的微传感器的表面拟合精度。采用本研究中提出的补偿方法,误差小于全压力量程的0.02%FS(温度范围为-40至85°C,压力范围为200 kPa至2000 kPa)。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/e484bb8596be/micromachines-11-01022-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/041544058003/micromachines-11-01022-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/1772d9a902c8/micromachines-11-01022-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/a05c7972becd/micromachines-11-01022-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/6abe443704c3/micromachines-11-01022-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/b88b9c06437a/micromachines-11-01022-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/26991201024d/micromachines-11-01022-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/e484bb8596be/micromachines-11-01022-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/041544058003/micromachines-11-01022-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/1772d9a902c8/micromachines-11-01022-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/a05c7972becd/micromachines-11-01022-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/6abe443704c3/micromachines-11-01022-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/b88b9c06437a/micromachines-11-01022-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/26991201024d/micromachines-11-01022-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/593a/7700299/e484bb8596be/micromachines-11-01022-g007.jpg

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本文引用的文献

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Sensors (Basel). 2019 May 16;19(10):2272. doi: 10.3390/s19102272.
3
A Resonant Pressure Microsensor Based on Double-Ended Tuning Fork and Electrostatic Excitation/Piezoresistive Detection.
高性能微机电系统压力传感器的进展:设计、制造与封装
Microsyst Nanoeng. 2023 Dec 19;9:156. doi: 10.1038/s41378-023-00620-1. eCollection 2023.
4
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Micromachines (Basel). 2021 Apr 1;12(4):382. doi: 10.3390/mi12040382.
基于双端调谐叉和静电激励/压阻检测的共振压力微传感器。
Sensors (Basel). 2018 Aug 1;18(8):2494. doi: 10.3390/s18082494.
4
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Sensors (Basel). 2015 Apr 29;15(5):10048-58. doi: 10.3390/s150510048.
5
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