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热电偶与无芯片射频识别技术集成及动态刺激传感的当前进展

Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus.

作者信息

Mc Gee Kevin, Anandarajah Prince, Collins David

机构信息

School of Biotechnology, Dublin City University, Dublin 9, Ireland.

The National Centre for Sensor Research (NCSR), Research & Engineering Building, Dublin City University, Dublin 9, Ireland.

出版信息

Micromachines (Basel). 2020 Nov 20;11(11):1019. doi: 10.3390/mi11111019.

DOI:10.3390/mi11111019
PMID:33233732
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7699856/
Abstract

To date, no printable chipless Radio Frequency Identification (RFID) sensor-related publications in the current literature discuss the possibility of thermocouple integration, particularly for the use in extreme environments. Furthermore, the effects of a time-dependent stimulus on the scattering parameters of a chipless RFID have never been discussed in the known literature. This work includes a review of possible methods to achieve this goal and the design and characterization of a Barium Strontium Titanate (BST) based VHF/UHF voltage sensing circuit. Proof-of-concept thermocouple integration was attempted, and subsequent testing was performed using a signal generator. These subsequent tests involved applying ramp and sinusoid voltage waveforms to the circuit and the characteristics of these signals are largely extracted from the scattering response. Overall conclusions of this paper are that thermocouple integration into chipless RFID technology is still a significant challenge and further work is needed to identify methods of thermocouple integration. With that being said, the developed circuit shows promise as being capable of being configured into a conventional chipless RFID DC voltage sensor.

摘要

迄今为止，当前文献中没有关于可打印无芯片射频识别（RFID）传感器的出版物讨论热电偶集成的可能性，特别是在极端环境中的应用。此外，已知文献中从未讨论过随时间变化的刺激对无芯片RFID散射参数的影响。这项工作包括对实现这一目标的可能方法的综述，以及基于钛酸锶钡（BST）的甚高频/超高频电压传感电路的设计和特性分析。尝试了概念验证的热电偶集成，并使用信号发生器进行了后续测试。这些后续测试包括向电路施加斜坡和正弦电压波形，并且这些信号的特性主要从散射响应中提取。本文的总体结论是，将热电偶集成到无芯片RFID技术中仍然是一项重大挑战，需要进一步开展工作以确定热电偶集成的方法。话虽如此，所开发的电路显示出有望能够配置成传统的无芯片RFID直流电压传感器。

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