Department of Molecular Chemistry and Biochemistry, Doshisha University, Kyotanabe, Kyoto 610-0321, Japan.
Inorg Chem. 2021 Apr 19;60(8):5474-5482. doi: 10.1021/acs.inorgchem.0c02954. Epub 2020 Dec 1.
Dicopper complexes of a new -cresol-2,6-bis(dpa) amide-tether ligand (HL1), Cu(μ-OH)(μ-1,3-OAc)(L1) () and [Cu(μ-1,1-OAc)(μ-1,3-OAc)(L1)]X (X = ClO (), OAc ()) were synthesized and structurally characterized. rapidly cleaves supercoiled plasmid DNA by activating HO at neutral pH to a linear DNA and shows remarkable cytotoxicity in comparison with related complexes. As is more cytotoxic than HL1, the dicopper core is kept in the cell. A boron dipyrromethene (Bodipy)-modified complex of the -cresol-2,6-bis(dpa) amide-tether ligand having a Bodipy pendant (HL2), Cu(μ-OAc)(L2) (), was synthesized to visualize intracellular behavior, suggesting that attacks the nucleolus and mitochondria. A comet assay clearly shows that does not cleave nuclear DNA. The apoptotic cell death is evidenced from flow cytometry.
合成并结构表征了一种新的邻甲酚-2,6-双(二吡啶酰胺)酰胺键配体(HL1)的二铜配合物,Cu(μ-OH)(μ-1,3-OAc)(L1) () 和 [Cu(μ-1,1-OAc)(μ-1,3-OAc)(L1)]X(X = ClO (),OAc ())。 在中性 pH 下通过激活 HO 将超螺旋质粒 DNA 快速切割成线性 DNA,并表现出与相关配合物相比显著的细胞毒性。由于 比 HL1 更具细胞毒性,因此二铜核保持在细胞内。合成了具有硼二吡咯甲川(Bodipy)侧链的邻甲酚-2,6-双(二吡啶酰胺)酰胺键配体的 Bodipy 修饰配合物 Cu(μ-OAc)(L2) (),用于可视化细胞内行为,表明 攻击核仁线粒体。彗星试验清楚地表明 不会切割核 DNA。从流式细胞术可以看出凋亡细胞死亡。