Holder Daniel, Weber Rudolf, Röcker Christoph, Kunz Gerhard, Bruneel David, Delaigue Martin, Graf Thomas, Ahmed Marwan Abdou
Opt Lett. 2021 Jan 15;46(2):384-387. doi: 10.1364/OL.411412.
We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 µm to limit the peak fluence per pulse to approximately 0.7/, and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of ≤0.6µ were achieved up to the investigated milling depth of 313 µm while maintaining a high material removal rate of 230/min.
我们报道了使用亚皮秒激光对硅进行高质量、高通量激光铣削的研究，该激光在工件上的平均激光功率超过1千瓦。为了避免热积累效应，通过采用五脉冲串、372 µm的大光束直径以将每个脉冲的峰值能量密度限制在约0.7 /，以及24 m/s的高进给速度，使高质量激光铣削的加工策略适应可用的平均功率。结果，在达到313 µm的研究铣削深度时，实现了低粗糙度（≤0.6µ）的光滑表面，同时保持了230 /分钟的高材料去除率。
