Peng Chun-Hao, Hou Po-Yu, Lin Woei-Shyang, Shen Pai-Keng, Huang Hao-Hsuan, Yeh Jien-Wei, Yen Hung-Wei, Huang Cheng-Yao, Tsai Che-Wei
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan.
High Entropy Materials Center, National Tsing Hua University, Hsinchu 30013, Taiwan.
Materials (Basel). 2023 Jan 30;16(3):1193. doi: 10.3390/ma16031193.
Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the addition of Fe was discussed in intermetallic compound formation. Moreover, microstructures, age hardening, and dry sliding wear resistances of the present alloy were analyzed and compared with C17200 beryllium copper. The results showed that the present alloy performed extraordinarily, with 314 HV in hardness and 22.2 %IACS in conductivity, which is almost similar to C17200 alloy. Furthermore, the dry sliding wear resistance of the present alloy was 2199.3 (m/MPa·mm) at an ambient temperature, leading to an improvement of 208% compared with the C17200 alloy.
基于采用沉淀硬化的多组分合金，制备了一种Cu-Ni-Si-Fe铜合金，并对其硬度、电导率和耐磨性进行了研究。观察到铜镍硅（Cu-Ni-Si）金属间化合物作为析出物，导致机械性能和物理性能有所提高。此外，还讨论了铁在金属间化合物形成中的添加情况。此外，分析了该合金的微观结构、时效硬化和干滑动耐磨性，并与C17200铍铜进行了比较。结果表明，该合金表现出色，硬度为314 HV，电导率为22.2 %IACS，与C17200合金几乎相似。此外，该合金在环境温度下的干滑动耐磨性为2199.3（m/MPa·mm），与C17200合金相比提高了208%。
