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在电流作用下使用不同固化灯和黏结系统对牙本质进行树脂复合材料黏结。

Resin composite adhesion to dentin using different curing lights and adhesive systems applied under electric current.

机构信息

School of Dentistry, University of Taubate, Taubate, SP, Brazil.

São Carlos School of Engineering, University of São Paulo, São Carlos, SP, Brazil.

出版信息

Clin Oral Investig. 2021 Sep;25(9):5181-5188. doi: 10.1007/s00784-021-03824-9. Epub 2021 Feb 8.

Abstract

OBJECTIVES

To evaluate the effect of electric current application on the resin composite-tooth bond strength and hybrid layer of three adhesive systems light-cured by two light-curing units (LCUs).

MATERIALS AND METHODS

Human molar teeth were distributed into 12 groups (n=6). Three adhesive systems were used: two-step etch-and-rinse (SB2; Adper Single Bond 2, 3M ESPE); two-step self-etch (CSE; Clearfil SE Bond, Kuraray); and one-step self-etch (SBU; Single Bond Universal, 3M ESPE) applied with (50μA) and without (control; conventional application) electric current, and light-cured with different LCUs. Resin composite blocks (Filtek Z350XT, 3M ESPE) were produced and cut into sticks (~1mm) for microtensile bond strength (μTBS). Fracture patterns were analyzed on stereomicroscope and classified as cohesive-dentin, cohesive-resin, adhesive, or mixed. Specimens were prepared for scanning electron microscope observation. The hybrid layer analysis was carried out using a confocal laser scanning microscopy (n=2). Data were submitted to three-way ANOVA followed by Tukey's post hoc test (α=0.05).

RESULTS

The electric current increased the μTBS for all adhesive systems light-cured with single-emission peak and multiple-emission peak LCUs. Both LCUs presented similar μTBS values. CSE applied under electric current showed the highest μTBS mean values. The adhesive failure pattern was more frequently observed in all groups. The electric current formed long resin tags for all adhesive systems.

CONCLUSIONS

The adhesive systems applied under electric current increased the bond strength using single-emission peak and multiple-emission peak LCUs.

CLINICAL RELEVANCE

Electric current at 50μA applied throughout the dentin is a safe mode and results in better impregnation of the adhesive systems.

摘要

目的

评估电流应用对三种粘接系统(两步酸蚀冲洗型[SB2;Adper Single Bond 2,3M ESPE]、两步自酸蚀型[CSE;Clearfil SE Bond,Kuraray]和一步自酸蚀型[SBU;Single Bond Universal,3M ESPE])和两种光固化单元(LCU)光固化后的树脂复合-牙体粘接强度和混合层的影响。

材料和方法

将人磨牙分为 12 组(n=6)。使用三种粘接系统:两步酸蚀冲洗型(SB2;Adper Single Bond 2,3M ESPE)、两步自酸蚀型(CSE;Clearfil SE Bond,Kuraray)和一步自酸蚀型(SBU;Single Bond Universal,3M ESPE),并施加(50μA)和不施加(对照;常规应用)电流,用两种不同的 LCU 光固化。制作树脂复合块(Filtek Z350XT,3M ESPE)并切割成棒状(~1mm)进行微拉伸粘接强度(μTBS)测试。在立体显微镜下分析断裂模式,并分为牙本质内聚性、树脂内聚性、粘接性或混合性。制备扫描电子显微镜观察标本。使用共聚焦激光扫描显微镜进行混合层分析(n=2)。数据采用三因素方差分析,随后进行 Tukey 事后检验(α=0.05)。

结果

电流增加了所有用单发射峰和多发射峰 LCU 光固化的粘接系统的 μTBS。两种 LCU 均表现出相似的 μTBS 值。电流作用下的 CSE 表现出最高的 μTBS 平均值。所有组均更常观察到粘接失败模式。电流为所有粘接系统形成了长的树脂突。

结论

电流应用于粘接系统可提高使用单发射峰和多发射峰 LCU 的粘接强度。

临床相关性

50μA 的电流应用于整个牙本质是一种安全模式,可更好地浸渍粘接系统。

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