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基于投影微立体光刻技术(PμSL)的三维可拉伸微电子学。

Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL).

机构信息

Department of Mechanical Engineering, City University of Hong Kong, Kowloon 999077, Hong Kong SAR, China.

Nanomanufacturing Laboratory (NML), City University of Hong Kong Shenzhen Research Institute, Shenzhen 518057, China.

出版信息

ACS Appl Mater Interfaces. 2021 Feb 24;13(7):8901-8908. doi: 10.1021/acsami.0c20162. Epub 2021 Feb 15.

DOI:10.1021/acsami.0c20162
PMID:33587597
Abstract

Stretchable and flexible electronics conformal to human skin or implanted into biological tissues has attracted considerable interest for emerging applications in health monitoring and medical treatment. Although various stretchable materials and structures have been designed and manufactured, most are limited to two-dimensional (2D) layouts for interconnects and active components. Here, by using projection microstereolithography (PμSL)-based three-dimensional (3D) printing, we introduce a versatile microfabrication process to push the manufacturing limit and achieve previously inaccessible 3D geometries at a high resolution of 2 μm. After coating the printed microstructures with thin Au films, the 3D conductive structures offer exceptional stretchability (∼130%), conformability, and stable electrical conductivity (<5% resistance change at 100% tensile strain). This fabrication process can be further applied to directly create complicated 3D interconnect networks of sophisticated active components, as demonstrated with a stretchable capacitive pressure sensor array here. The proposed scheme allows a simple, facile, and scalable manufacturing route for complex, integrated 3D flexible electronic systems.

摘要

可拉伸和灵活的电子产品贴合人体皮肤或植入生物组织,为健康监测和医疗治疗的新兴应用吸引了相当大的兴趣。尽管已经设计和制造了各种可拉伸材料和结构,但大多数仅限于二维 (2D) 布局的互连和有源元件。在这里,我们通过使用基于投影微立体光刻 (PμSL) 的三维 (3D) 打印,引入了一种通用的微制造工艺,以推动制造极限,并以 2 μm 的高分辨率实现以前无法达到的 3D 几何形状。在将打印的微结构涂覆薄薄的金膜后,3D 导电结构提供了出色的拉伸性(约 130%)、贴合性和稳定的导电性(在 100%拉伸应变下电阻变化<5%)。该制造工艺可以进一步应用于直接创建复杂的有源组件的复杂 3D 互连网络,这里展示了一个可拉伸电容压力传感器阵列。所提出的方案为复杂的集成 3D 柔性电子系统提供了一种简单、方便和可扩展的制造途径。

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