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3D 打印微结构用于柔性电子设备。

3D printed microstructures for flexible electronic devices.

机构信息

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, People's Republic of China.

出版信息

Nanotechnology. 2019 Oct 11;30(41):414001. doi: 10.1088/1361-6528/ab2d5d. Epub 2019 Jun 27.

Abstract

Flexible and stretchable electronics have attracted increasing attention and been widely used in wearable devices and electronic skins, where the circuits for flexible and stretchable electronics are typically in-plane-based 2D geometries. Here, we introduce a 3D microprinting technology that can expand one more dimension of the circuit in flexible electronics. We fabricated three-dimensional serpentine microstructures based on direct laser writing. These microstructures with a thin metal coated layer can be used as stretchable conducting meshes. Soft silicone serving as a substrate and encapsulations for these 3D microstructures enables great light transmittance (>90% in visible light range) and flexibility with 114° bending and 24° twisting. Further optimization of the mechanical design of the 3D microstructures can also enhance the stretchability up to 13.8%. These results indicate 3D flexible electronics can be realized by simple microprinting methods. Furthermore, 3D microprinting would also allow for the precise fabrication of other 3D structures, such as mechanically active 3D mesostructures, for the function of mechanical and electrical testing.

摘要

柔性和拉伸电子产品受到了越来越多的关注,并被广泛应用于可穿戴设备和电子皮肤中,其中柔性和拉伸电子产品的电路通常是基于平面的 2D 几何形状。在这里,我们介绍了一种 3D 微打印技术,它可以扩展柔性电子产品中电路的另一个维度。我们基于直接激光写入制造了三维蛇形微结构。这些具有薄金属涂层的微结构可用作可拉伸的导电网格。软硅酮作为基底和这些 3D 微结构的封装材料,具有高透光率(可见光范围内>90%)和灵活性,可以弯曲 114°和扭曲 24°。进一步优化 3D 微结构的机械设计也可以将拉伸性提高到 13.8%。这些结果表明,3D 柔性电子产品可以通过简单的微打印方法实现。此外,3D 微打印还可以允许精确制造其他 3D 结构,例如机械活性 3D 介观结构,用于机械和电气测试的功能。

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