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用于硅太阳能电池的溶液掺杂多晶硅钝化接触

Solution-Doped Polysilicon Passivating Contacts for Silicon Solar Cells.

作者信息

Yang Xinbo, Kang Jingxuan, Liu Wenzhu, Zhang Xiaohong, De Wolf Stefaan

机构信息

College of Energy, Soochow Institute for Energy and Materials InnovationS (SIEMIS), Soochow University, Suzhou 215006, China.

KAUST Solar Center, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia.

出版信息

ACS Appl Mater Interfaces. 2021 Feb 24;13(7):8455-8460. doi: 10.1021/acsami.0c22127. Epub 2021 Feb 16.

DOI:10.1021/acsami.0c22127
PMID:33590751
Abstract

In this work, we present a simple and efficient solution-doping process for preparing high-quality polycrystalline silicon (poly-Si)-based passivating contacts. Commercial phosphorus or boron-doping solutions are spin-coated on crystalline silicon (c-Si) wafers that feature SiO/poly-Si layers; the doping process is then activated by thermal annealing at high temperatures in a nitrogen atmosphere. With optimized n- and p-type solution doping and thermal annealing, n- and p-type poly-Si passivating contacts featuring simultaneously a low contact recombination parameter () of 2.4 and 12 fA/cm and a low contact resistivity (ρ) of 29 and 20 mΩ·cm are achieved, respectively. Taking advantage of the single-sided nature of these solution-doping processes, c-Si solar cells with poly-Si passivating contacts of opposite polarity on the respective wafer surfaces are fabricated using a simple coannealing process, achieving the best power conversion efficiency (PCE) of 18.5% on a planar substrate. Overall, the solution-doping method is demonstrated to be a simple and promising alternative to gas/ion implantation doping for poly-Si passivating-contact manufacturing.

摘要

在这项工作中,我们展示了一种简单高效的溶液掺杂工艺,用于制备高质量的基于多晶硅(poly-Si)的钝化接触。将商业磷或硼掺杂溶液旋涂在具有SiO/poly-Si层的晶体硅(c-Si)晶圆上;然后在氮气气氛中通过高温热退火激活掺杂过程。通过优化的n型和p型溶液掺杂及热退火,分别实现了具有2.4和12 fA/cm的低接触复合参数()以及29和20 mΩ·cm的低接触电阻率(ρ)的n型和p型多晶硅钝化接触。利用这些溶液掺杂工艺的单面特性,通过简单的共退火工艺在各自的晶圆表面制造具有相反极性的多晶硅钝化接触的c-Si太阳能电池,在平面衬底上实现了18.5%的最佳功率转换效率(PCE)。总体而言,溶液掺杂方法被证明是用于多晶硅钝化接触制造的气体/离子注入掺杂的一种简单且有前景的替代方法。

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