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有机电子加速前行:无掩膜、溶液处理的有机晶体管工作频率达160兆赫

Organic Electronics Picks Up the Pace: Mask-Less, Solution Processed Organic Transistors Operating at 160 MHz.

作者信息

Perinot Andrea, Giorgio Michele, Mattoli Virgilio, Natali Dario, Caironi Mario

机构信息

Center for Nano Science and Technology@PoliMi Istituto Italiano di Tecnologia Milan 20133 Italy.

Center for Micro-BioRobotics Istituto Italiano di Tecnologia Pontedera 56025 Italy.

出版信息

Adv Sci (Weinh). 2021 Jan 4;8(4):2001098. doi: 10.1002/advs.202001098. eCollection 2021 Feb.

Abstract

Organic printed electronics has proven its potential as an essential enabler for applications related to healthcare, entertainment, energy, and distributed intelligent objects. The possibility of exploiting solution-based and direct-writing production schemes further boosts the benefits offered by such technology, facilitating the implementation of cheap, conformable, bio-compatible electronic applications. The result shown in this work challenges the widespread assumption that such class of electronic devices is relegated to low-frequency operation, owing to the limited charge mobility of the materials and to the low spatial resolution achievable with conventional printing techniques. Here, it is shown that solution-processed and direct-written organic field-effect transistors can be carefully designed and fabricated so to achieve a maximum transition frequency of 160 MHz, unlocking an operational range that was not available before for organics. Such range was believed to be only accessible with more performing classes of semiconductor materials and/or more expensive fabrication schemes. The present achievement opens a route for cost- and energy-efficient manufacturability of flexible and conformable electronics with wireless-communication capabilities.

摘要

有机印刷电子技术已证明其作为医疗保健、娱乐、能源和分布式智能物体相关应用的关键推动因素的潜力。采用基于溶液和直接书写的生产方案的可能性进一步提升了该技术的优势,促进了廉价、贴合、生物兼容的电子应用的实现。这项工作中展示的结果挑战了一种普遍的假设,即由于材料的电荷迁移率有限以及传统印刷技术可实现的空间分辨率较低,此类电子设备只能在低频下运行。在此表明,经过溶液处理和直接书写的有机场效应晶体管可以经过精心设计和制造,从而实现高达160兆赫兹的最大转换频率,开启了有机材料此前无法达到的工作范围。此前人们认为只有性能更优的半导体材料类别和/或更昂贵的制造方案才能实现这样的范围。目前的这一成果为具有无线通信能力的柔性贴合电子产品的经济高效制造开辟了一条道路。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f3d1/7887599/962368cc7d06/ADVS-8-2001098-g001.jpg

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