Shastri Shivprasad S, Pandey Sudhir K
School of Engineering, Indian Institute of Technology Mandi, Kamand - 175075, India.
J Phys Condens Matter. 2021 Jun 7;33(26). doi: 10.1088/1361-648X/abfab4.
This work, presents a study of lifetime of carriers due to intrinsic scattering mechanisms viz. electron-electron interaction (EEI), electron-phonon interaction (EPI) and phonon-phonon interaction (PPI) in a promising half-Heusler thermoelectric FeVSb. Using the full-method, the effect of EEI and temperature on the valence and conduction band extrema and band gap are studied. The lifetime of carriers with temperature are estimated at these band extrema. At 300 K, estimated value of lifetime at VBM (CBM) is ∼1.91 × 10 s (∼2.05 × 10 s). The estimated ground state band gap considering EEI is ∼378 meV. Next, the effect of EPI on the lifetime of electrons and phonons with temperature are discussed. The comparison of two electron lifetimes suggests that EEI should be considered in transport calculations along with EPI. The average acoustic, optical and overall phonon lifetimes due to EPI are studied with temperature. Further, the effect of PPI is studied by computing average phonon lifetime for acoustic and optical phonon branches. The lifetime of the acoustic phonons are higher compared to optical phonons which indicates acoustic phonons contribute more to lattice thermal conductivity (). The comparison of phonon lifetime due to EPI and PPI suggests that, above 500 K EPI is the dominant phonon scattering mechanism and cannot be ignored incalculations. Lastly, a prediction of the power factor and figure of merit of n-type and p-type FeVSb is made by considering the temperature dependent carrier lifetime for the electronic transport terms. This study shows the importance of considering EEI in electronic transport calculations and EPI in phonon transport calculations in FeVSb. Our study is expected to provide results to further explore the thermoelectric transport in this material.
这项工作对一种很有前景的半赫斯勒热电材料FeVSb中由于本征散射机制,即电子-电子相互作用(EEI)、电子-声子相互作用(EPI)和声子-声子相互作用(PPI)导致的载流子寿命进行了研究。使用全方法,研究了EEI和温度对价带和导带极值以及带隙的影响。在这些能带极值处估计了载流子寿命随温度的变化。在300 K时,价带顶(导带底)处的寿命估计值约为1.91×10⁻¹³ s(约2.05×10⁻¹³ s)。考虑EEI时估计的基态带隙约为378 meV。接下来,讨论了EPI对电子和声子寿命随温度的影响。两种电子寿命的比较表明,在输运计算中应将EEI与EPI一起考虑。研究了由于EPI导致的平均声学、光学和整体声子寿命随温度的变化。此外,通过计算声学和光学声子分支的平均声子寿命来研究PPI的影响。声学声子的寿命比光学声子的寿命高,这表明声学声子对晶格热导率(κ)的贡献更大。EPI和PPI导致的声子寿命的比较表明在500 K以上EPI是主要的声子散射机制,在计算中不能忽略。最后,通过考虑电子输运项中随温度变化的载流子寿命,对n型和p型FeVSb的功率因子和品质因数进行了预测。这项研究表明在FeVSb的电子输运计算中考虑EEI以及在声子输运计算中考虑EPI的重要性。我们的研究有望为进一步探索这种材料中的热电输运提供结果。