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用于微转移印刷的新型微结构印章的粘附性能研究

Adhesion performance study of a novel microstructured stamp for micro-transfer printing.

作者信息

Liang Cunman, Wang Fujun, Huo Zhichen, Shi Beichao, Tian Yanling, Zhang Dawei

机构信息

Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, School of Mechanical Engineering, Tianjin University, Tianjin 300350, China.

出版信息

Soft Matter. 2021 May 19;17(19):4989-4997. doi: 10.1039/d0sm02161j.

DOI:10.1039/d0sm02161j
PMID:33899836
Abstract

Micro-transfer printing is an effective method that enables the integration of micro-scale heterogeneous materials for flexible electronics. As the key component of micro-transfer printing equipment, the stamp is adopted to pick up and print microdevices due to its reversible and controllable adhesion. In this paper, we propose a novel microstructured stamp based on the bionic theory, which consists of a microchamber and four microchannels. A theoretical model about the pressure change of the gas in the microchamber is established and the effects of compression distance and pull-up velocity on the pull-off force of the stamp are investigated. The performance test results show that the pull-off force of the stamp can be controlled by both the compression distance and the pull-up velocity. Finally, micro-transfer printing operations of microdevices with different sizes, shapes and materials are realized based on the proposed microstructured stamp. The results show that the proposed microstructured stamp exhibits good performance in the transfer printing of microdevices, and provides a new way for the design of microstructured stamps for micro-transfer printing without an extra excitation system.

摘要

微转移印刷是一种有效的方法,可实现用于柔性电子器件的微尺度异质材料的集成。作为微转移印刷设备的关键部件,印章因其可逆且可控的粘附性而被用于拾取和印刷微器件。在本文中,我们基于仿生理论提出了一种新型微结构印章,它由一个微腔和四个微通道组成。建立了关于微腔内气体压力变化的理论模型,并研究了压缩距离和提拉速度对印章脱模力的影响。性能测试结果表明,印章的脱模力可通过压缩距离和提拉速度来控制。最后,基于所提出的微结构印章实现了不同尺寸、形状和材料的微器件的微转移印刷操作。结果表明,所提出的微结构印章在微器件的转移印刷中表现出良好的性能,为无需额外激励系统的微转移印刷微结构印章的设计提供了一种新方法。

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引用本文的文献

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Laser-induced adhesives with excellent adhesion enhancement and reduction capabilities for transfer printing of microchips.具有出色附着力增强和降低能力的激光诱导粘合剂,用于微芯片的转移印刷。
Sci Adv. 2024 Dec 6;10(49):eads9226. doi: 10.1126/sciadv.ads9226.
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Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing.用于柔性电子集成制造的微转移印刷技术研究进展
Micromachines (Basel). 2021 Nov 3;12(11):1358. doi: 10.3390/mi12111358.