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具有高热导率和优异绝缘性能的仿生多巴胺修饰膨胀石墨/硅橡胶复合材料的制备及机理研究。

Preparation and mechanism research of bio-inspired dopamine decorated expanded graphite/silicone rubber composite with high thermal conductivity and excellent insulation.

机构信息

Sino-German Joint Research Center of Advanced Materials, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai, 200237, People's Republic of China.

出版信息

Nanotechnology. 2021 May 17;32(32). doi: 10.1088/1361-6528/abfb9d.

DOI:10.1088/1361-6528/abfb9d
PMID:33902011
Abstract

This study looked at the process of designing and synthesized expanded graphite (EG) and modifying it with bio-inspired dopamine (DOPA). This is a process used to improve the thermal conductivity and dielectric properties of methyl vinyl silicone rubber (VMQ). The results demonstrated that the EG-DOPA-VMQ composites acquired an exceptional thermal conductivity of 1.015 W mKat the loading of 10 wt%, approximately 480% higher than that of pure silicone rubber (0.175 W mK). This enhancement is mainly attributed to the improved dispersion capability of EG-DOPA and the robust interfacial interaction between EG-DOPA-VMQ interfaces; specifically, this is the result when compared with pristine EG. Moreover, throughout this process, the composites maintained an excellent insulating property with a resistance of ≈10Ω · cm; this particular result was due to the DOPA deposited on EG surfaces because they acted as an insulating layer, inhibiting the electron transfer in composites. Overall, this work demonstrated that it could present a promising strategy for synchronized manufacturing of polymer composites with high thermal conductivity and insulating capability.

摘要

本研究着眼于设计和合成膨胀石墨(EG)并对其进行生物启发的多巴胺(DOPA)修饰的过程。这是一种用于提高甲基乙烯基硅橡胶(VMQ)的热导率和介电性能的方法。结果表明,EG-DOPA-VMQ 复合材料在 10wt%的负载下获得了 1.015 W mK 的优异热导率,比纯硅橡胶(0.175 W mK)高约 480%。这种增强主要归因于 EG-DOPA 的改善分散能力和 EG-DOPA-VMQ 界面之间的强界面相互作用;具体来说,与原始 EG 相比,这是一个结果。此外,在整个过程中,复合材料保持了出色的绝缘性能,电阻约为 10Ω·cm;这一特定结果是由于 DOPA 沉积在 EG 表面上,因为它们充当绝缘层,抑制了复合材料中的电子转移。总的来说,这项工作表明,它可以为具有高热导率和绝缘能力的聚合物复合材料的同步制造提供一种有前途的策略。

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