Ultralight and High-Strength SiC@SiC Foam with Highly Efficient Microwave Absorption and Heat Insulation Properties.

An ultralight and high-strength SiC@SiC foam with highly efficient microwave absorption and heat insulation properties was successfully synthesized using the template sacrifice method and chemical vapor deposition process. The microstructure is a novel double network structure, which is formed by the coupling of the morphology-controlled SiC and the SiC skeleton. The introduction of SiC can not only provide more interface polarization and dielectric loss to the SiC foam, which greatly enhances the microwave absorption capacity of the composite foam, but also can enable it to act as an excellent radiation absorbent, which can effectively reduce the thermal conductivity of the foam, especially at high temperatures. In this study, a minimum reflection loss () of -52.49 dB was achieved at 2.82 mm thickness with an effective absorption bandwidth of 5.6 GHz. As the length/diameter ratio of SiC decreases, the composite foam exhibits excellent high-temperature thermal insulation and mechanical properties. For the SiC@SiC foam, the thermal conductivity is only 0.304 W/mK at 1200 °C and the compressive strength reaches 1.53 MPa. This multifunctional SiC@SiC foam is an outstanding material, which has potential applications in microwave absorption and high-temperature heat insulation in harsh environments.