Hiraba Haruto, Koizumi Hiroyasu, Kodaira Akihisa, Takehana Kosuke, Yoneyama Takayuki, Matsumura Hideo
Department of Fixed Prosthodontics, Nihon University School of Dentistry, 1-8-13, Kanda-Surugadai, Chiyoda-ku, Tokyo 101-8310, Japan.
Division of Advanced Dental Treatment, Dental Research Center, Nihon University School of Dentistry, 1-8-13, Kanda-Surugadai, Chiyoda-ku, Tokyo 101-8310, Japan.
Materials (Basel). 2021 Apr 2;14(7):1753. doi: 10.3390/ma14071753.
This study was conducted to clarify the influence of the copper surface oxidation and reduction on the shear-bond strength with functional monomers. Unheated copper specimens (UH; = 88) were wet-ground. Three-quarters of the UH were then heated (HT). Two-thirds of the HT was then immersed in a hydrochloric acid solution (AC). Half of the AC was then reheated (RH). Each group was further divided into two groups ( = 11), which were primed by either 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or 10-methacryloyloxydecyl dihydrogen phosphate (MDP). The shear-bond strength tests were used for bonding with an acrylic resin. The surface roughness values and chemical states of the four groups were analyzed using a confocal scanning laser microscope and X-ray photoelectron spectroscopy (XPS). The shear-bond strengths of HT and RH were the lowest in the MTU-6-primed groups. The result of AC was significantly lower than others in the MDP-primed groups. The XPS results showed that the surfaces of UH and AC consisted of CuO and Cu. The surface changed to CuO upon heating. The presence or absence of copper-oxide films showed the opposite trends in the effectiveness of MTU-6 and MDP to improve bond strength. The results could elucidate the effects of functional monomers on copper-oxide films.
本研究旨在阐明铜表面氧化和还原对与功能单体的剪切粘结强度的影响。对未加热的铜试样（UH；n = 88）进行湿磨。然后将四分之三的UH加热（HT）。接着将三分之二的HT浸入盐酸溶液（AC）中。然后将一半的AC再次加热（RH）。每组进一步分为两组（n = 11），分别用6-甲基丙烯酰氧基己基2-硫尿嘧啶-5-羧酸盐（MTU-6）或10-甲基丙烯酰氧基癸基磷酸二氢酯（MDP）进行预处理。使用剪切粘结强度测试来与丙烯酸树脂进行粘结。使用共聚焦扫描激光显微镜和X射线光电子能谱（XPS）分析四组的表面粗糙度值和化学状态。在MTU-6预处理组中，HT和RH的剪切粘结强度最低。在MDP预处理组中，AC的结果明显低于其他组。XPS结果表明，UH和AC的表面由CuO和Cu组成。加热后表面变为CuO。氧化铜膜的存在与否在MTU-6和MDP提高粘结强度的有效性方面呈现相反的趋势。这些结果可以阐明功能单体对氧化铜膜的影响。
