用于喷墨制造柔性电子元件的水溶性铜墨水。
Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components.
作者信息
Shabanov Nabi S, Rabadanov Kamil Sh, Suleymanov Sagim I, Amirov Akhmed M, Isaev Abdulgalim B, Sobola Dinara S, Murliev Eldar K, Asvarova Gulnara A
机构信息
Analytical Center for Collective Use, Dagestan Federal Research Centre of the Russian Academy of Sciences, 367001 Makhachkala, Russia.
Department of Inorganic Chemistry and Chemical Ecology, Dagestan State University, St. M. Gadjieva 43-a, Dagestan Republic, 367015 Makhachkala, Russia.
出版信息
Materials (Basel). 2021 Apr 26;14(9):2218. doi: 10.3390/ma14092218.
The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.
这项工作的目的是通过使用不同类型的功能油墨进行印刷来制备和研究铜导电路径。基于含铜络合物的溶液被用作油墨，而不是金属纳米颗粒的分散体。在氩气气氛中通过热重分析法研究了合成前体的热特性。基于分解温度的比较，发现甲酸铜二甲胺络合物是形成铜层更合适的前体。通过X射线衍射、润湿性测试、在柔性基板上印刷以及电学测量对该化合物的结构和性能进行了详细研究。
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