Tan Wenyu, He Hanwei, Gao Ying, Peng Yizhi, Dai Xiaomei
Powder Metallurgy Research Institute, Central South University, Changsha 410083, China.
Powder Metallurgy Research Institute, Central South University, Changsha 410083, China.
J Colloid Interface Sci. 2021 Oct 15;600:492-502. doi: 10.1016/j.jcis.2021.05.002. Epub 2021 May 5.
Electrocatalysts for water splitting have been widely explored among recent years. In this study, nickel-selenium-copper (Ni-Se-Cu) coating was synthesized on nickel foam through potentiostatic electrodeposition. The electrochemical kinetics and nucleation mechanisms of the deposition were investigated, and the diffusion coefficient D from different deposition potentials and temperatures was calculated. Results reveal that the electrodeposition of Ni-Se-Cu follows an instantaneous nucleation and diffusion-controlled three-dimensional (3D) growth mechanism. Deposition potential and bath temperature slightly effect the nucleation mechanism of electrodeposition. The apparent activation energy E of the hydrogen evolution reaction (HER) in 1.0 M KOH electrolyte of Ni-Se-Cu is 21.1 kJ·mol, which is lower than that of Ni-Se (37.7 kJ·mol). The majority phase formed by nickel and selenium is NiSe, and a Ni(Cu) solid solution forms after the incorporation of Cu atoms into a Ni lattice.
近年来，用于水分解的电催化剂受到了广泛研究。在本研究中，通过恒电位电沉积在泡沫镍上合成了镍-硒-铜（Ni-Se-Cu）涂层。研究了沉积的电化学动力学和成核机制，并计算了不同沉积电位和温度下的扩散系数D。结果表明，Ni-Se-Cu的电沉积遵循瞬时成核和扩散控制的三维（3D）生长机制。沉积电位和镀液温度对电沉积的成核机制影响较小。在1.0 M KOH电解液中，Ni-Se-Cu析氢反应（HER）的表观活化能E为21.1 kJ·mol，低于Ni-Se的表观活化能（37.7 kJ·mol）。镍和硒形成的主要相为NiSe，在Cu原子掺入Ni晶格后形成Ni（Cu）固溶体。
