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高耦合硫化铜纳米晶体组件的化学计量掺杂

Stoichiometric Doping of Highly Coupled CuS Nanocrystal Assemblies.

作者信息

Lee Minkyoung, Yang Jeehye, Lee HanKyul, Lee Jong Ik, Koirala Agni Raj, Park Juhyung, Jo Hyunwoo, Kim Seunghan, Park Hanna, Kwak Jeonghun, Yoo Hyobin, Huh Wansoo, Kang Moon Sung

机构信息

Department of Chemical and Biomolecular Engineering, Sogang University, Seoul 04107, Korea.

Department of Chemistry, Korea Center for Artificial Photosynthesis (KCAP), Sogang University, Seoul 04107, Korea.

出版信息

ACS Appl Mater Interfaces. 2021 Jun 9;13(22):26330-26338. doi: 10.1021/acsami.1c03853. Epub 2021 May 26.

DOI:10.1021/acsami.1c03853
PMID:34037381
Abstract

The hole density of individual copper sulfide nanocrystals (CuS NCs) is determined from the stoichiometric mismatch () between copper and sulfide atoms. Consequently, the electronic properties of the material vary over a range of . To exploit CuS NCs in devices, assemblies of NCs are typically required. Herein, we investigate the influence of , referred to as the stoichiometric doping effect, on the structural, optical, electrical, and thermoelectric properties of electronically coupled CuS NC assemblies. The doping process is done by immersing the solid NC assemblies into a solution containing a Cu(I) complex for different durations (0-10 min). As Cu gradually occupied the copper-deficient sites of CuS NCs, could be controlled from 0.9 to less than 0.1. Consequently, the near-infrared (NIR) absorbance of CuS NC assemblies changes systematically with . With increasing , electrical conductivity increased and the Seebeck coefficient decreased systematically, leading to the maximal thermoelectric power factor from a film of CuS NCs at an optimal doping condition yielding = 0.1. The physical characteristics of the CuS NC assemblies investigated herein will provide guidelines for exploiting this emerging class of nanocrystal system based on doping.

摘要

单个硫化铜纳米晶体(CuS NCs)的空穴密度由铜原子与硫原子之间的化学计量失配()决定。因此,材料的电子性质在一定范围内变化。为了在器件中利用CuS NCs,通常需要纳米晶体的组装体。在此,我们研究了被称为化学计量掺杂效应的对电子耦合的CuS NC组装体的结构、光学、电学和热电性质的影响。掺杂过程是通过将固态NC组装体浸入含有Cu(I)络合物的溶液中不同时间(0 - 10分钟)来完成的。随着Cu逐渐占据CuS NCs的缺铜位点,可从0.9控制到小于0.1。因此,CuS NC组装体的近红外(NIR)吸光度随系统地变化。随着的增加,电导率增加,塞贝克系数系统地降低,在最佳掺杂条件= 0.1时,从CuS NC薄膜获得最大热电功率因子。本文研究的CuS NC组装体的物理特性将为基于掺杂开发这类新兴纳米晶体系统提供指导。

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