Garbowski Tomasz, Grabski Jakub Krzysztof, Marek Aleksander
Department of Biosystems Engineering, Poznan University of Life Sciences, Wojska Polskiego 50, 60-627 Poznań, Poland.
Institute of Applied Mechanics, Poznan University of Technology, Jana Pawła II 24, 60-965 Poznań, Poland.
Materials (Basel). 2021 May 26;14(11):2840. doi: 10.3390/ma14112840.
This article focuses on the derivation of simplified predictive models for the identification of the overall compressive stiffness and strength of corrugated cardboards. As a representative example an unsymmetrical 5-ply sample (with E and B flute) was used in this study. In order to exclude unreliable displacement measurement in the standard edge crush test, virtual strain gauges were used. Video extensometry was employed to collect measurements from the outer surfaces of the sample on both sides. Additional data allowed real force-displacement curves to be obtained, which were used in the validation procedure. To emulate the experimental results, besides a simple analytical model, a 3D numerical model fully reflecting the geometry of the corrugated board, based on the finite elements method was also built. In both cases good agreement between the experimental results and the analytical and numerical calculations was observed. This proved that the proposed analytical model can be successfully used to determine the overall stiffness and compressive strength of corrugated board, provided that the geometry and properties of all the layers of the board are known. The simple model presented in this work enables quick and reliable design and prototyping of new assemblies without the need to manufacture them.
本文着重于推导用于识别瓦楞纸板整体抗压刚度和强度的简化预测模型。作为一个代表性示例，本研究使用了一个不对称的五层样本（E型和B型瓦楞）。为了排除标准边缘抗压试验中不可靠的位移测量，使用了虚拟应变片。采用视频引伸计从样本两侧的外表面收集测量数据。额外的数据使得能够获得真实的力-位移曲线，并将其用于验证过程。为了模拟实验结果，除了一个简单的分析模型外，还基于有限元方法建立了一个能完全反映瓦楞纸板几何形状的三维数值模型。在这两种情况下，均观察到实验结果与分析及数值计算之间具有良好的一致性。这证明了所提出的分析模型能够成功地用于确定瓦楞纸板的整体刚度和抗压强度，前提是已知纸板所有层的几何形状和性能。本文提出的简单模型能够在无需制造新组件的情况下，快速且可靠地进行新组件的设计和原型制作。
