Garbowski Tomasz, Knitter-Piątkowska Anna, Marek Aleksander
Department of Biosystems Engineering, Poznan University of Life Sciences, Wojska Polskiego 50, 60-627 Poznań, Poland.
Institute of Structural Analysis, Poznan University of Technology, Piotrowo 5, 60-965 Poznań, Poland.
Materials (Basel). 2021 Oct 2;14(19):5768. doi: 10.3390/ma14195768.
The standard edge crush test (ECT) allows the determination of the crushing strength of the corrugated cardboard. Unfortunately, this test cannot be used to estimate the compressive stiffness, which is an equally important parameter. This is because any attempt to determine this parameter using current lab equipment quickly ends in a fiasco. The biggest obstacle is obtaining a reliable measurement of displacements and strains in the corrugated cardboard sample. In this paper, we present a method that not only allows for the reliable identification of the stiffness in the loaded direction of orthotropy in the corrugated board sample, but also the full orthotropic material stiffness matrix. The proposed method uses two samples: (a) traditional, cut crosswise to the wave direction of the corrugated core, and (b) cut at an angle of 45°. Additionally, in both cases, an optical system with digital image correlation (DIC) was used to measure the displacements and strains on the outer surfaces of samples. The use of a non-contact measuring system allowed us to avoid using the measurement of displacements from the crosshead, which is burdened with a large error. Apart from the new experimental configuration, the article also proposes a simple algorithm to quickly characterize all sought stiffness parameters. The obtained results are finally compared with the results obtained in the homogenization procedure of the cross-section of the corrugated board. The results were consistent in both cases.
标准边缘抗压强度试验(ECT)可用于测定瓦楞纸板的抗压强度。遗憾的是,该试验无法用于估算抗压刚度,而抗压刚度同样是一个重要参数。这是因为使用当前实验室设备来测定该参数的任何尝试都会很快以失败告终。最大的障碍在于获取瓦楞纸板样品中位移和应变的可靠测量值。在本文中,我们提出了一种方法,该方法不仅能够可靠地识别瓦楞纸板样品在正交各向异性加载方向上的刚度,还能识别完整的正交各向异性材料刚度矩阵。所提出的方法使用两个样品:(a)传统的,沿瓦楞芯的波向横向切割;(b)以45°角切割。此外,在这两种情况下,均使用带有数字图像相关(DIC)的光学系统来测量样品外表面的位移和应变。使用非接触测量系统使我们能够避免使用十字头位移测量,十字头位移测量存在较大误差。除了新的实验配置外,本文还提出了一种简单算法,以快速表征所有所需的刚度参数。最后将所得结果与瓦楞纸板横截面均匀化过程中获得的结果进行比较。两种情况下的结果均一致。