Hua Xiang, Zhang Datong, Kim Bumho, Seo Dongjea, Kang Kyungnam, Yang Eui-Hyeok, Hu Jiayang, Chen Xianda, Liang Haoran, Watanabe Kenji, Taniguchi Takashi, Hone James, Kim Young Duck, Herman Irving P
Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027, United States.
Department of Mechanical Engineering, Columbia University, New York, New York 10027, United States.
ACS Appl Mater Interfaces. 2021 Jul 7;13(26):31271-31278. doi: 10.1021/acsami.1c06348. Epub 2021 Jun 25.
Chemical vapor deposition (CVD)-grown flakes of high-quality monolayers of WS can be stabilized at elevated temperatures by encapsulation with several layer hexagonal boron nitride (BN), but to different degrees in the presence of ambient air, flowing N, and flowing forming gas (95% N, 5% H). The best passivation of WS at elevated temperature occurs for -BN-covered samples with flowing N (after heating to 873 K), as judged by optical microscopy and photoluminescence (PL) intensity after a heating/cooling cycle. Stability is worse for uncovered samples, but best with flowing forming gas. PL from trions, in addition to that from excitons, is seen for covered WS only for forming gas, during cooling below ∼323 K; the trion has an estimated binding energy of ∼28 meV. It might occur because of doping level changes caused by charge defect generation by H molecules diffusing between the -BN and the SiO/Si substrate. The decomposition of uncovered WS flakes in air suggests a dissociation and chemisorption energy barrier of O on the WS surface of ∼1.6 eV. Fitting the high-temperature PL intensities in air gives a binding energy of a free exciton of 229 meV.
通过用几层六方氮化硼(BN)封装,化学气相沉积(CVD)生长的高质量WS单层薄片可以在高温下稳定,但在环境空气、流动氮气和流动形成气体(95%N,5%H)存在的情况下,稳定程度不同。通过光学显微镜和加热/冷却循环后的光致发光(PL)强度判断,对于在流动氮气中(加热到873K后)的 -BN覆盖样品,WS在高温下的钝化效果最佳。未覆盖样品的稳定性较差,但在流动形成气体时最佳。仅在冷却至约323K以下时,对于覆盖的WS,在形成气体的情况下,除了激子的PL外,还能看到来自三重态激子的PL;三重态激子的估计结合能约为28meV。这可能是由于H分子在 -BN和SiO/Si衬底之间扩散产生电荷缺陷导致掺杂水平变化所致。未覆盖的WS薄片在空气中的分解表明,O在WS表面的解离和化学吸附能垒约为1.6eV。拟合空气中的高温PL强度得出自由激子的结合能为229meV。