Zhang Lian, Wang Rong, Liu Zhe, Cheng Zhe, Tong Xiaodong, Xu Jianxing, Zhang Shiyong, Zhang Yun, Chen Fengxiang
Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.
Microsystem and Terahertz Research Center, China Academy of Engineering Physics, Chengdu 610200, China.
Materials (Basel). 2021 Sep 16;14(18):5339. doi: 10.3390/ma14185339.
This work studied the regulation of hole concentration and mobility in p-InGaN layers grown by metalorganic chemical vapor deposition (MOCVD) under an N-rich environment. By adjusting the growth temperature, the hole concentration can be controlled between 6 × 10/cm and 3 × 10/cm with adjustable hole mobility from 3 to 16 cm/V.s. These p-InGaN layers can meet different requirements of devices for hole concentration and mobility. First-principles defect calculations indicate that the p-type doping of InGaN at the N-rich limiting condition mainly originated from Mg substituting In (Mg). In contrast with the compensation of nitrogen vacancy in p-type InGaN grown in a Ga-rich environment, the holes in p-type InGaN grown in an N-rich environment were mainly compensated by interstitial Mg (Mg), which has very low formation energy.
本工作研究了在富氮环境下通过金属有机化学气相沉积(MOCVD)生长的p型氮化铟镓(p-InGaN)层中空穴浓度和迁移率的调控。通过调节生长温度,空穴浓度可控制在6×10/cm至3×10/cm之间,空穴迁移率可在3至16 cm²/V·s之间调节。这些p-InGaN层能够满足器件对空穴浓度和迁移率的不同要求。第一性原理缺陷计算表明,在富氮极限条件下InGaN的p型掺杂主要源于镁取代铟(MgIn)。与在富镓环境中生长的p型InGaN中氮空位的补偿不同,在富氮环境中生长的p型InGaN中的空穴主要由形成能非常低的间隙镁(Mgi)补偿。