Chen Wen, Zhang Linwei, Yang Shangshu, Jia Wenhan, Zhang Songsong, Gu Yuandong, Lou Liang, Wu Guoqiang
Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
Shanghai Industrial Technology Research Institute, Shanghai 201899, China.
Micromachines (Basel). 2021 Sep 17;12(9):1118. doi: 10.3390/mi12091118.
In this work, three-dimensional finite element analysis (3D FEA) of quasi-surface acoustic wave (QSAW) resonators with high accuracy is reported. The QSAW resonators consist of simple molybdenum (Mo) interdigitated transducers (IDT) on solidly mounted stacked layers of AlN/Mo/Si. Different to the SAW resonators operating in the piezoelectric substrates, the reported resonators are operating in the QSAW mode, since the IDT-excited Rayleigh waves not only propagate in the thin piezoelectric layer of AlN, but also penetrate the Si substrate. Compared with the commonly used two-dimensional (2D) FEA approach, the 3D FEA method reported in this work shows high accuracy, in terms of the resonant frequency, temperature coefficient of frequency (TCF), effective coupling coefficient (keff2) and frequency response. The fabricated QSAW resonator has demonstrated a keff2 of 0.291%, series resonant frequency of 422.50 MHz, and TCF of -23.418 ppm/°C in the temperature range between 30 °C and 150 °C, for the design of wavelength at 10.4 μm. The measurement results agree well with the simulations. Moreover, the QSAW resonators are more mechanically robust than lamb wave devices and can be integrated with silicon-based film bulk acoustic resonator (FBAR) devices to offer multi-frequency function in a single chip.
在这项工作中,报道了对准表面声波(QSAW)谐振器进行高精度的三维有限元分析(3D FEA)。QSAW谐振器由位于AlN/Mo/Si固体安装堆叠层上的简单钼(Mo)叉指换能器(IDT)组成。与在压电基片中工作的表面声波(SAW)谐振器不同,所报道的谐振器以QSAW模式工作,因为IDT激发的瑞利波不仅在AlN的薄压电层中传播,还会穿透Si衬底。与常用的二维(2D)有限元分析方法相比,这项工作中报道的3D有限元分析方法在谐振频率、频率温度系数(TCF)、有效耦合系数(keff2)和频率响应方面显示出高精度。对于10.4μm波长的设计,所制造的QSAW谐振器在30°C至150°C的温度范围内,展示出0.291%的keff2、422.50 MHz的串联谐振频率和-23.418 ppm/°C的TCF。测量结果与模拟结果吻合良好。此外,QSAW谐振器在机械上比兰姆波器件更坚固,并且可以与基于硅的薄膜体声波谐振器(FBAR)器件集成,以在单个芯片中提供多频功能。