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利用声学反射层补偿频率温度系数对固态安装谐振器整体性能的影响。

Effects of compensating the temperature coefficient of frequency with the acoustic reflector layers on the overall performance of solidly mounted resonators.

作者信息

Munir Junaid, Mirea Teona, DeMiguel-Ramos Mario, Saeed M A, Bin Shaari Amiruddin, Iborra Enrique

机构信息

Department of Physics, Faculty of Science, Universiti Teknologi Malaysia, 81310 Johor Bahru, Johor, Malaysia.

GMME-CEMDATIC-ETSI de Telecomunicación, Universidad Politécnica de Madrid, 28040 Madrid, Spain.

出版信息

Ultrasonics. 2017 Feb;74:153-160. doi: 10.1016/j.ultras.2016.10.010. Epub 2016 Oct 18.

Abstract

Thin film acoustic wave resonator based devices require compensation of temperature coefficient of frequency (TCF) in many applications. This work presents the design and fabrication of temperature compensated solidly mounted resonators (SMRs). The characteristics of each material of the layered structure have an effect on the device TCF but depending on the relative position with respect to the piezoelectric material in the stack. The influence of material properties of the different layers composing the device on the TCF is discussed in detail. TCF behavior simulation is done with Mason's model and, to take into account the deterioration of overall performance due to the finite lateral size and shape of the resonator, we have used 2D and 3D finite element modelling of the resonators. The overall behavior of the device for external loads is predicted. SMRs are designed according to simulations and fabricated with different configurations to obtain TCF as near to zero as possible with an optimized response. Resonators are made by depositing Mo/AlN/Mo piezoelectric stacks on acoustic reflectors. As reflector materials, conductive W and insulating WO films have been used as high acoustic impedance materials. SiO films are used as low acoustic impedance material.

摘要

基于薄膜声波谐振器的器件在许多应用中需要对频率温度系数(TCF)进行补偿。本文介绍了温度补偿固态安装谐振器(SMR)的设计与制造。层状结构中每种材料的特性都会对器件的TCF产生影响,但这取决于其在堆叠中相对于压电材料的相对位置。详细讨论了构成器件的不同层的材料特性对TCF的影响。利用梅森模型进行了TCF行为模拟,并且为了考虑由于谐振器有限的横向尺寸和形状导致的整体性能下降,我们对谐振器进行了二维和三维有限元建模。预测了器件在外部负载下的整体行为。根据模拟结果设计了SMR,并制造了不同配置的SMR,以通过优化响应使TCF尽可能接近零。谐振器是通过在声反射器上沉积Mo/AlN/Mo压电叠层制成的。作为反射器材料,导电W和绝缘WO薄膜已被用作高声阻抗材料。SiO薄膜用作低声阻抗材料。

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