Hammond Alec M, Oskooi Ardavan, Johnson Steven G, Ralph Stephen E
Opt Express. 2021 Jul 19;29(15):23916-23938. doi: 10.1364/OE.431188.
We present a unified density-based topology-optimization framework that yields integrated photonic designs optimized for manufacturing constraints including all those of commercial semiconductor foundries. We introduce a new method to impose minimum-area and minimum-enclosed-area constraints, and simultaneously adapt previous techniques for minimum linewidth, linespacing, and curvature, all of which are implemented without any additional re-parameterizations. Furthermore, we show how differentiable morphological transforms can be used to produce devices that are robust to over/under-etching while also satisfying manufacturing constraints. We demonstrate our methodology by designing three broadband silicon-photonics devices for nine different foundry-constraint combinations.
我们提出了一个基于密度的统一拓扑优化框架，该框架可生成针对制造约束（包括所有商业半导体代工厂的约束）进行优化的集成光子设计。我们引入了一种新方法来施加最小面积和最小封闭面积约束，并同时采用先前的技术来处理最小线宽、线间距和曲率，所有这些都无需任何额外的重新参数化即可实现。此外，我们展示了如何使用可微形态变换来生产对过蚀刻/欠蚀刻具有鲁棒性同时又满足制造约束的器件。我们通过为九种不同的代工厂约束组合设计三种宽带硅光子器件来演示我们的方法。
