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Transferable, Deep-Learning-Driven Fast Prediction and Design of Thermal Transport in Mechanically Stretched Graphene Flakes.

作者信息

Liu Qingchang, Gao Yuan, Xu Baoxing

机构信息

Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.

出版信息

ACS Nano. 2021 Oct 26;15(10):16597-16606. doi: 10.1021/acsnano.1c06340. Epub 2021 Oct 14.

Abstract

Piling graphene sheets into a bulk form is essential for achieving massive applications of graphene in flexible structures and devices, and the arbitrary shape, random distributions, and adjacent overlaps of graphene sheets are yet challenging the prediction of its fundamental properties that are strongly coupled by mechanical strength and thermal or electronic transport. Here, we present a deep neural network (DNN)-based machine learning (ML) approach that enables the prediction of thermal conductivity of piled graphene structures with a broad range of geometric configurations and dimensions in response to external mechanical loading. A physics-informed pixel value matrix is developed to capture the key geometric features of piled graphene structures and is incorporated into the DNN to train the ML model with the only training data ratio of 12.5% but the prediction accuracy of 94%. The ML model is further extended with the transferred knowledge from primitive training data sets to predict the thermal transport of piled graphene in a custom data set. Extensive demonstrations in search of piled graphene structures with desirable thermal conductivity and its response to mechanical loading are presented and illustrate the capability and accuracy of the DNN-ML model for establishing a mechanically adaptive structure: responsive thermal property paradigm in piled graphene. This work lays a foundation for quantitatively evaluating thermal conductivity of piled graphene in response to mechanical loadings through an ML model and also offers a rational route for exploring mechanically tunable thermal properties of nanomaterial-based bulk forms, potentially useful in the design of flexible thermal structures and devices with controllable thermal management performance.

摘要

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