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二维半导体欧姆接触的现状与展望

Status and prospects of Ohmic contacts on two-dimensional semiconductors.

作者信息

Ni Junhao, Fu Quangui, Ostrikov Kostya Ken, Gu Xiaofeng, Nan Haiyan, Xiao Shaoqing

机构信息

Engineering Research Center of IoT Technology Applications (Ministry of Education), Department of Electronic Engineering, Jiangnan University, Wuxi 214122, People's Republic of China.

School of Chemistry and Physics and QUT Centre for Materials Science, Queensland University of Technology (QUT), Brisbane QLD 4000, Australia.

出版信息

Nanotechnology. 2021 Nov 18;33(6). doi: 10.1088/1361-6528/ac2fe1.

Abstract

In recent years, two-dimensional materials have received more and more attention in the development of semiconductor devices, and their practical applications in optoelectronic devices have also developed rapidly. However, there are still some factors that limit the performance of two-dimensional semiconductor material devices, and one of the most important is Ohmic contact. Here, we elaborate on a variety of approaches to achieve Ohmic contacts on two-dimensional materials and reveal their physical mechanisms. For the work function mismatch problem, we summarize the comparison of barrier heights between different metals and 2D semiconductors. We also examine different methods to solve the problem of Fermi level pinning. For the novel 2D metal-semiconductor contact methods, we analyse their effects on reducing contact resistance from two different perspectives: homojunction and heterojunction. Finally, the challenges of 2D semiconductors in achieving Ohmic contacts are outlined.

摘要

近年来,二维材料在半导体器件的发展中受到越来越多的关注,并且它们在光电器件中的实际应用也迅速发展。然而,仍然存在一些因素限制二维半导体材料器件的性能,其中最重要的因素之一是欧姆接触。在此,我们详细阐述了在二维材料上实现欧姆接触的多种方法,并揭示了它们的物理机制。针对功函数不匹配问题,我们总结了不同金属与二维半导体之间势垒高度的比较。我们还研究了解决费米能级钉扎问题的不同方法。对于新颖的二维金属 - 半导体接触方法,我们从同质结和异质结这两个不同角度分析了它们对降低接触电阻的影响。最后,概述了二维半导体在实现欧姆接触方面面临的挑战。

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