Liu Kailang, Luo Peng, Han Wei, Yang Sanjun, Zhou Shasha, Li Huiqiao, Zhai Tianyou
State Key Laboratory of Material Processing and Die & Mould Technology, School of Material Sciences and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
State Key Laboratory of Material Processing and Die & Mould Technology, School of Material Sciences and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
Sci Bull (Beijing). 2019 Oct 15;64(19):1426-1435. doi: 10.1016/j.scib.2019.06.021. Epub 2019 Jun 26.
Two-dimensional semiconductors have attracted immense research interests owing to their intriguing properties and promising applications in electronic and optoelectronic devices. However, the performance of these devices is drastically hindered by the large Schottky barrier at the electric contact interface, which is hardly tunable due to the Fermi level pinning effect. In this review, we will analyze the root causes of the contact problems for the two-dimensional semiconductor devices and summarize the strategies on the basis of different contact geometries, aiming to lift out the Fermi level pinning effect and achieve the ohmic contact. Moreover, the remarkable improvement of the device performance thanks to these optimized contacts will be emphasized. At the end, the merits and limitations of these strategies will be discussed as well, which potentially gives a guideline for handling the electric contact issues in two-dimensional semiconductors devices.
二维半导体因其引人入胜的特性以及在电子和光电器件中的应用前景而引起了广泛的研究兴趣。然而,这些器件的性能受到电接触界面处大肖特基势垒的严重阻碍,由于费米能级钉扎效应,该势垒几乎无法调节。在本综述中,我们将分析二维半导体器件接触问题的根本原因,并基于不同的接触几何结构总结策略,旨在消除费米能级钉扎效应并实现欧姆接触。此外,还将强调这些优化接触对器件性能的显著提升。最后,也将讨论这些策略的优缺点,这可能为处理二维半导体器件中的电接触问题提供指导。