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调控MXenes/二维碳化硅接触的肖特基势垒:官能团和双轴应变的第一性原理研究

Modulating the Schottky barrier of MXenes/2D SiC contacts functional groups and biaxial strain: a first-principles study.

作者信息

Huang Lingqin, Deng Xuliang, Pan Sumin, Cui Wenwen

机构信息

School of Electrical Engineering and Automation, Jiangsu Normal University, Xuzhou 221116, China.

Laboratory of Quantum Materials Design and Application, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou 221116, China.

出版信息

Phys Chem Chem Phys. 2022 Sep 14;24(35):20837-20847. doi: 10.1039/d2cp02351b.

Abstract

Two-dimensional (2D) graphene-like SiC has attracted intense interest recently due to its unique electrical and physical properties. In implementing 2D semiconductors in device applications, one of the main challenges so far has been the formation of a high-quality Schottky barrier owing to the strong Fermi level pinning (FLP) at the interface of traditional metal-2D semiconductor contacts. In this paper, the 2D MXenes TiCT (T = F, O, OH) are proposed to serve as electrodes for 2D SiC. The structural and barrier properties of the TiCT/SiC contacts were systematically investigated based on first-principles calculations combined with the GGA-PBE and HSE06 functionals. It is found that TiCT can be bonded with 2D SiC by van der Waals (vdW) interactions. Weak FLP is exhibited at TiCT/SiC vdW contacts. The type of contact can be tuned by changing the functional T group of TiCT. TiCF/SiC and TiCO/SiC contacts exhibit a p-type Schottky contact and p-type Ohmic contact, respectively, whereas an n-type Ohmic contact occurs in the TiC(OH)/SiC contact. In addition, the calculated tunneling possibility () is ∼20% between TiCT and SiC, indicating weak bonding at the TiCT/SiC vdW junctions. Furthermore, the Schottky barrier height and of the TiC(OH)/SiC contacts can be modulated the biaxial strain. The controllable contact type and barrier in TiCT/SiC contacts provide guidelines for developing high-performance 2D SiC optoelectronic and electronic devices.

摘要

二维(2D)类石墨烯碳化硅(SiC)因其独特的电学和物理性质,近年来引起了广泛关注。在将二维半导体应用于器件时,迄今为止主要挑战之一是由于传统金属 - 二维半导体接触界面处存在强费米能级钉扎(FLP),难以形成高质量的肖特基势垒。本文提出二维MXenes TiCT(T = F、O、OH)作为二维SiC的电极。基于第一性原理计算,结合广义梯度近似(GGA - PBE)和HSE06泛函,系统研究了TiCT/SiC接触的结构和势垒特性。研究发现,TiCT可通过范德华(vdW)相互作用与二维SiC键合。TiCT/SiC vdW接触处表现出较弱的费米能级钉扎。通过改变TiCT的官能团T可调节接触类型。TiCF/SiC和TiCO/SiC接触分别表现出p型肖特基接触和p型欧姆接触,而TiC(OH)/SiC接触则为n型欧姆接触。此外,计算得出TiCT和SiC之间的隧穿概率约为20%,表明TiCT/SiC vdW结处键合较弱。此外,TiC(OH)/SiC接触的肖特基势垒高度和可以通过双轴应变进行调制。TiCT/SiC接触中可控的接触类型和势垒为开发高性能二维SiC光电器件和电子器件提供了指导。

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