Xu Xiangming, Guo Tianchao, Hota Mrinal K, Kim Hyunho, Zheng Dongxing, Liu Chen, Hedhili Mohamed Nejib, Alsaadi Rajeh S, Zhang Xixiang, Alshareef Husam N
Materials Science and Engineering, Physical Science and Engineering, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955-6900, Saudi Arabia.
Core Laboratories, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955-6900, Saudi Arabia.
Adv Mater. 2022 Dec;34(48):e2107370. doi: 10.1002/adma.202107370. Epub 2021 Dec 4.
It is very challenging to employ solution-processed conducting films in large-area ultrathin nanoelectronics. Here, spray-coated Ti C T MXene films as metal contacts are successfully integrated into sub-10 nm gate oxide 2D MoS transistor circuits. Ti C T films are spray coated on glass substrates followed by vacuum annealing. Compared to the as-prepared sample, vacuum annealed films exhibit a higher conductivity (≈11 000 S cm ) and a lower work function (≈4.5 eV). Besides, the annealed Ti C T film can be patterned through a standard cleanroom process without peeling off. The annealed Ti C T film shows a better band alignment for n-type transport in MoS channel with small work function mismatch of 0.06 eV. The MoS film can be uniformly transferred on the patterned Ti C T surface and then readily processed through the cleanroom process. A large-area array of Ti C T MXene-MoS transistors is fabricated using different dielectric thicknesses and semiconducting channel sizes. High yield and stable performance for these transistor arrays even with an 8 nm-thick dielectric layer are demonstrated. Besides, several circuits are demonstrated, including rectifiers, negative-channel metal-oxide-semiconductor (NMOS) inverters, and voltage-shift NMOS inverters. Overall, this work indicates the tremendous potential for solution-processed Ti C T MXene films in large-area 2D nanoelectronics.
在大面积超薄纳米电子学中应用溶液处理的导电薄膜极具挑战性。在此,通过喷雾涂覆的Ti C T MXene薄膜作为金属触点成功集成到亚10纳米栅极氧化物二维MoS晶体管电路中。将Ti C T薄膜喷雾涂覆在玻璃基板上,然后进行真空退火。与制备好的样品相比,真空退火后的薄膜表现出更高的电导率(≈11000 S/cm)和更低的功函数(≈4.5 eV)。此外,退火后的Ti C T薄膜可以通过标准的洁净室工艺进行图案化处理而不会剥落。退火后的Ti C T薄膜在MoS沟道中对于n型传输表现出更好的能带对准,功函数失配小,为0.06 eV。MoS薄膜可以均匀地转移到图案化的Ti C T表面,然后通过洁净室工艺轻松进行处理。使用不同的介电层厚度和半导体沟道尺寸制造了大面积的Ti C T MXene-MoS晶体管阵列。即使对于8纳米厚的介电层,这些晶体管阵列也展示出了高成品率和稳定的性能。此外,还展示了几种电路,包括整流器、负沟道金属氧化物半导体(NMOS)反相器和电压移位NMOS反相器。总体而言,这项工作表明溶液处理的Ti C T MXene薄膜在大面积二维纳米电子学中具有巨大潜力。