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利用“牺牲性”弱结合配体大规模合成用于印刷电子的杂化导电聚合物-金纳米粒子

Large-Scale Synthesis of Hybrid Conductive Polymer-Gold Nanoparticles Using "Sacrificial" Weakly Binding Ligands for Printing Electronics.

作者信息

Escudero Alberto, González-García Lola, Strahl Robert, Kang Dong Jin, Drzic Juraj, Kraus Tobias

机构信息

INM─Leibniz Institute for New Materials, Campus D2 2, 66123 Saarbrücken, Germany.

Departamento de Química Inorgánica and Instituto de Investigaciones Químicas (IIQ), Universidad de Sevilla─CSIC, Calle Américo Vespucio 49, 41092 Seville, Spain.

出版信息

Inorg Chem. 2021 Nov 15;60(22):17103-17113. doi: 10.1021/acs.inorgchem.1c02350. Epub 2021 Nov 4.

DOI:10.1021/acs.inorgchem.1c02350
PMID:34735769
Abstract

We describe the gram-scale synthesis of hybrid gold nanoparticles with a shell of conductive polymers. A large-scale synthesis of hexadecyltrimethylammonium bromide (CTAB)-capped gold nanoparticles (AuNP@CTAB) was followed by ligand exchange with conductive polymers based on thiophene in a 10 L reactor equipped with a jacket to ensure a constant temperature of 40 °C and a mechanical stirrer. Slow and controlled reduction of the gold precursors and the presence of small amounts of silver nitrate are revealed to be the critical synthesis variables to obtain particles with a sufficiently narrow size distribution. Batches of approximately 10 g of faceted AuNP@CTAB with tunable average particle sizes from 54 to 85 nm were obtained per batch. Ligand exchange with poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) in the same reactor then yielded hybrid Au@PEDOT:PSS nanoparticles. They were used to formulate sinter-free inks for the inkjet printing of conductive structures without the need for a sintering step.

摘要

我们描述了具有导电聚合物壳层的杂化金纳米颗粒的克级合成方法。在一个配备夹套以确保温度恒定在40°C的10 L反应器中,先大规模合成十六烷基三甲基溴化铵(CTAB)包覆的金纳米颗粒(AuNP@CTAB),然后与基于噻吩的导电聚合物进行配体交换,并使用机械搅拌器。结果表明,缓慢且可控地还原金前驱体以及存在少量硝酸银是获得尺寸分布足够窄的颗粒的关键合成变量。每批可获得约10 g平均粒径可调(54至85 nm)的多面体形AuNP@CTAB。然后在同一反应器中与聚(3,4 - 乙撑二氧噻吩):聚苯乙烯磺酸盐(PEDOT:PSS)进行配体交换,得到杂化Au@PEDOT:PSS纳米颗粒。它们被用于配制无需烧结步骤即可用于喷墨打印导电结构的无烧结油墨。

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