Lee Ga Yeon, Yeo Seungmin, Han Seong Ho, Park Bo Keun, Eom Taeyong, Kim Jeong Hwan, Kim Soo-Hyun, Kim Hyungjun, Son Seung Uk, Chung Taek-Mo
Thin Film Materials Research Center, Korea Research Institute of Chemical Technology, Daejeon 34114, Republic of Korea.
Department of Chemistry, Sungkyunkwan University, Suwon 16419, Republic of Korea.
Inorg Chem. 2021 Dec 6;60(23):17722-17732. doi: 10.1021/acs.inorgchem.1c02339. Epub 2021 Nov 23.
This paper describes the synthesis of eight novel zirconium and hafnium complexes containing -alkoxy carboxamidate-type ligands, as potential precursors for metal oxides and atomic layer deposition (ALD) for HfO. A series of ligands, viz., -ethoxy-2,2-dimethylpropanamide (edpaH), -ethoxy-2-methylpropanamide (empaH), and -methoxy-2,2-dimethylpropanamide (mdpaH), were used to afford complexes Zr(edpa) (), Hf(edpa) (), Zr(empa) (), Hf(empa) (), Zr(mdpa) (), Hf(mdpa) (), ZrCp(edpa) (), and HfCp(edpa) (). Thermogravimetric analysis curves assessed for the evaporation characteristics of complexes - revealed single-step weight losses with low residues, except for the mdpa-containing complexes. Single-crystal X-ray diffraction studies of , , , and revealed that all the complexes have monomeric molecular structures, with the central metal ion surrounded by eight oxygen atoms from the four bidentate alkoxyalkoxide ligands. Among the complexes prepared, exhibited a low melting point (64 °C), good volatility (1 Torr at 112 °C), high thermal stability, and excellent endurance over 6 weeks at 120 °C. Therefore, an ALD process for the growth of HfO was developed using HfCp(edpa) () as a novel precursor. Furthermore, the HfO film exhibited a low capacitance equivalent oxide thickness of ∼1.5 nm, with as low as ∼3 × 10 A/cm at -1 V in a metal-insulator-semiconductor capacitor (Au/HfO/-Si).
本文描述了八种含有-烷氧基氨基甲酸酯型配体的新型锆和铪配合物的合成,这些配合物作为金属氧化物和用于HfO的原子层沉积(ALD)的潜在前驱体。使用了一系列配体,即-乙氧基-2,2-二甲基丙酰胺(edpaH)、-乙氧基-2-甲基丙酰胺(empaH)和-甲氧基-2,2-二甲基丙酰胺(mdpaH),以制备配合物Zr(edpa) ()、Hf(edpa) ()、Zr(empa) ()、Hf(empa) ()、Zr(mdpa) ()、Hf(mdpa) ()、ZrCp(edpa) ()和HfCp(edpa) ()。对配合物-的蒸发特性进行的热重分析曲线显示,除了含mdpa的配合物外,均为单步失重且残留量低。对、、和的单晶X射线衍射研究表明,所有配合物均具有单体分子结构,中心金属离子被来自四个双齿烷氧基醇盐配体的八个氧原子包围。在所制备的配合物中,表现出低熔点(64°C)、良好的挥发性(112°C时为1托)、高热稳定性以及在120°C下6周的优异耐久性。因此,使用HfCp(edpa) ()作为新型前驱体开发了一种用于生长HfO的ALD工艺。此外,在金属-绝缘体-半导体电容器(Au/HfO/-Si)中,HfO薄膜在-1 V时表现出约1.5 nm的低电容等效氧化物厚度,低至约3×10 A/cm。