Dehaghani Maryam Zarghami, Molaei Fatemeh, Yousefi Farrokh, Sajadi S Mohammad, Esmaeili Amin, Mohaddespour Ahmad, Farzadian Omid, Habibzadeh Sajjad, Mashhadzadeh Amin Hamed, Spitas Christos, Saeb Mohammad Reza
Center of Excellence in Electrochemistry, School of Chemistry, College of Science, University of Tehran, Tehran, Iran.
Mining and Geological Engineering Department, The University of Arizona, Arizona, USA.
Sci Rep. 2021 Nov 29;11(1):23064. doi: 10.1038/s41598-021-02576-6.
Simulation of thermal properties of graphene hetero-nanosheets is a key step in understanding their performance in nano-electronics where thermal loads and shocks are highly likely. Herein we combine graphene and boron-carbide nanosheets (BC3N) heterogeneous structures to obtain BC3N-graphene hetero-nanosheet (BC3GrHs) as a model semiconductor with tunable properties. Poor thermal properties of such heterostructures would curb their long-term practice. BCGrHs may be imperfect with grain boundaries comprising non-hexagonal rings, heptagons, and pentagons as topological defects. Therefore, a realistic picture of the thermal properties of BCGrHs necessitates consideration of grain boundaries of heptagon-pentagon defect pairs. Herein thermal properties of BCGrHs with various defects were evaluated applying molecular dynamic (MD) simulation. First, temperature profiles along BCGrHs interface with symmetric and asymmetric pentagon-heptagon pairs at 300 K, ΔT = 40 K, and zero strain were compared. Next, the effect of temperature, strain, and temperature gradient (ΔT) on Kaptiza resistance (interfacial thermal resistance at the grain boundary) was visualized. It was found that Kapitza resistance increases upon an increase of defect density in the grain boundary. Besides, among symmetric grain boundaries, 5-7-6-6 and 5-7-5-7 defect pairs showed the lowest (2 × 10 m K W) and highest (4.9 × 10 m K W) values of Kapitza resistance, respectively. Regarding parameters affecting Kapitza resistance, increased temperature and strain caused the rise and drop in Kaptiza thermal resistance, respectively. However, lengthier nanosheets had lower Kapitza thermal resistance. Moreover, changes in temperature gradient had a negligible effect on the Kapitza resistance.
模拟石墨烯异质纳米片的热性能是了解其在热负荷和冲击极有可能出现的纳米电子学中性能的关键一步。在此,我们将石墨烯和碳化硼纳米片(BC3N)异质结构相结合,以获得具有可调特性的BC3N-石墨烯异质纳米片(BC3GrHs)作为模型半导体。此类异质结构较差的热性能会限制其长期应用。BCGrHs可能存在不完美之处,其晶界包含非六边形环、七边形和五边形等拓扑缺陷。因此,要全面了解BCGrHs的热性能,就必须考虑七边形-五边形缺陷对的晶界情况。在此,我们应用分子动力学(MD)模拟评估了具有各种缺陷的BCGrHs的热性能。首先,比较了在300 K、ΔT = 40 K和零应变条件下,BCGrHs与对称和不对称五边形-七边形对界面处的温度分布。接下来,直观呈现了温度、应变和温度梯度(ΔT)对卡皮查电阻(晶界处的界面热阻)的影响。研究发现,晶界处缺陷密度增加时,卡皮查电阻会增大。此外,在对称晶界中,5-7-6-6和5-7-5-7缺陷对的卡皮查电阻分别显示出最低(2×10 m K W)和最高(4.9×10 m K W)值。关于影响卡皮查电阻的参数,温度升高会导致卡皮查热阻升高,而应变增加则会使卡皮查热阻降低。然而,更长的纳米片具有更低的卡皮查热阻。此外,温度梯度的变化对卡皮查电阻的影响可忽略不计。