Department of Restorative Dentistry, School of Dentistry, State University of Ponta Grossa, Rua Carlos Cavalcanti, 4748, Zip Code 84030-900, Campus Uvaranas, Ponta Grossa, Paraná, Brazil.
Department of Dentistry, Tuiuti University of Parana, Rua Sydnei Antonio Rangel Santos, 238, Zip Code 82010-330, Curitiba, Paraná, Brazil.
J Mech Behav Biomed Mater. 2022 Feb;126:105017. doi: 10.1016/j.jmbbm.2021.105017. Epub 2021 Dec 2.
To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (μTBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin-dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC).
CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the "x" direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the "x" and "y" directions to obtain resin-dentin beams for μTBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (α = 0.05).
The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (μTBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher μTBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05).
Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge.
This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.
评估将铜纳米粒子 (CuNp) 掺入通用胶粘剂中如何影响抗菌活性 (AMA)、粘结强度 (μTBS)、纳米渗漏 (NL)、弹性模量 (EM) 和树脂-牙本质界面的纳米硬度 (NH)，分别在 24 小时 (24 h) 和原位致龋挑战 (CC) 后。
将 CuNp(0%[对照]和 0.1wt%) 添加到胶粘剂中。去除釉质后，将胶粘剂涂于牙本质表面。每个修复牙被纵向切成两半，其中一半在 24 h 后进行评估，另一半被纳入放置在 10 名志愿者口腔内的口腔腭内设备之一，在 CC 中放置 14 天。之后，取出每一半牙，并收集形成的任何口腔生物膜。AMA 针对变形链球菌进行评估。对于 24 h 和 CC 组，将每一半牙在“x”方向上切成薄片，以获得每个 EM/NH 评估的一个切片。将每一半牙的剩余部分在“x”和“y”方向上切成薄片，以获得用于 μTBS 和 NL 评估的树脂-牙本质梁（24 h 和 CC）。应用方差分析和 Tukey 检验（α=0.05）。
CuNp 的存在显著提高了 AMA 以及所有评估的性能（24 h；p<0.05）。尽管所有组的胶粘剂性能（μTBS/NL）在 CC 后均下降（p<0.05），但含有 CuNp 的胶粘剂与无铜胶粘剂相比具有更高的 μTBS 和更低的 NL（p<0.05）。CC 后 CuNp 的掺入保持了 NH/EM 值（p<0.05）。
在胶粘剂中添加 0.1%CuNp 可能提供抗菌活性并提高其粘结和机械性能，即使在致龋挑战下也是如此。
这是第一项现场研究证明，将 CuNp 掺入胶粘剂中是一种可行的替代方法，可以提供抗菌性能并改善原位致龋挑战下混合层的完整性。
