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三维各向异性MXene/石墨烯聚合物复合材料的孤立固体壁辅助导热性能

Isolated Solid Wall-Assisted Thermal Conductive Performance of Three-Dimensional Anisotropic MXene/Graphene Polymeric Composites.

作者信息

Jin Liyuan, Wang Pei, Cao Wenjing, Song Na, Ding Peng

机构信息

Research Center of Nanoscience and Nanotechnology, College of Sciences, Shanghai University, 99 Shangda Road, Shanghai 200444, PR China.

出版信息

ACS Appl Mater Interfaces. 2022 Jan 12;14(1):1747-1756. doi: 10.1021/acsami.1c20267. Epub 2021 Dec 23.

DOI:10.1021/acsami.1c20267
PMID:34949092
Abstract

The introduction of three-dimensional (3D) continuous conformations in polymer materials is a convincing proposal for acquiring the desirable multifunction to fulfill the urgent demands of highly integrated electronic devices. However, the limited functional design of the filled aligned network remains challenging. Herein, directional self-assembly 3D MXene/graphene aerogels are fabricated as conductive networks for polyethylene glycol (PEG) matrix. Based on the uniaxial and biaxial ice template method, the temperature gradient affects the aligned arrangement of the 3D microstructure. The biaxial PEG/MXene/GR composites exhibit an enhanced through-plane thermal conductivity of 1.64 W m K at 10.6 vol % content, which is 522% higher than that of pure PEG. The influence of the biaxial self-assembly strategy compared with that of the uniaxial one on the thermal conductivity reaches the highest 333% when the weight ratio equals 1:1. Meanwhile, the same difference also occurs in the electromagnetic shielding interference (EMI) property. The advanced EMI-shielding effectiveness of the biaxial PM1G1 composites reaches ∼36 dB at the 2.5 mm thickness. This research provides valuable guidance for designing high-performance applications of anisotropic thermal management and EMI shielding in 5G telecommunications and mobile electronic devices.

摘要

在聚合物材料中引入三维(3D)连续构象是获得理想多功能性以满足高度集成电子设备迫切需求的一个有说服力的提议。然而,填充对齐网络的功能设计有限仍然具有挑战性。在此,定向自组装3D MXene/石墨烯气凝胶被制备为聚乙二醇(PEG)基体的导电网络。基于单轴和双轴冰模板法,温度梯度影响3D微观结构的对齐排列。双轴PEG/MXene/GR复合材料在10.6体积%含量时表现出增强的面内热导率,为1.64 W m⁻¹ K⁻¹,比纯PEG高522%。当重量比等于1:1时,双轴自组装策略与单轴自组装策略相比对热导率的影响最高达到333%。同时,电磁屏蔽干扰(EMI)性能也存在同样的差异。双轴PM1G1复合材料在2.5毫米厚度时的先进电磁屏蔽效能达到约36 dB。这项研究为设计5G电信和移动电子设备中各向异性热管理和电磁干扰屏蔽的高性能应用提供了有价值的指导。

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