Jin Liyuan, Cao Wenjing, Wang Pei, Song Na, Ding Peng
Research Center of Nanoscience and Nanotechnology, College of Sciences, Shanghai University, 99 Shangda Road, Shanghai, 200444, People's Republic of China.
Nanomicro Lett. 2022 Jun 14;14(1):133. doi: 10.1007/s40820-022-00877-7.
The multi-functionalization of polymer composites refers to the ability to connect multiple properties through simple structural design and simultaneously achieve multi-performance optimization. The large-scale design and mass production to realize the reasonable structure design of multifunctional polymer composites are urgently remaining challenges. Herein, the multifunctional MXene/graphene/polymer composites with three-dimensional thermally and electrically conductive network structures are fabricated via the utilization of the microstructure of the soft template, and a facile dispersion dip-coating approach. As a result, the polymer composites have a multi-performance improvement. At the MXene and graphene content of 18.7 wt%, the superior through-plane thermal conductivity of polymer composite is 2.44 W m K, which is 1118% higher than that of the polymer matrix. The electromagnetic interference (EMI) shielding effectiveness of the sample reaches 43.3 dB in the range of X-band. And the mechanical property of the sample has advanced 4 times compared with the polymer matrix. The excellent EMI shielding and thermal management performance, along with the effortless and easy-to-scalable producing techniques, imply promising perspectives of the polymer composites in the next-generation smart electronic devices.
聚合物复合材料的多功能化是指通过简单的结构设计连接多种性能并同时实现多性能优化的能力。实现多功能聚合物复合材料合理结构设计的大规模设计和批量生产仍然是亟待解决的挑战。在此，利用软模板的微观结构和简便的分散浸涂方法制备了具有三维热导电网络结构的多功能MXene/石墨烯/聚合物复合材料。结果，聚合物复合材料的多种性能得到了改善。在MXene和石墨烯含量为18.7 wt%时，聚合物复合材料优异的面内热导率为2.44 W m⁻¹ K⁻¹，比聚合物基体高1118%。样品在X波段范围内的电磁干扰（EMI）屏蔽效能达到43.3 dB。并且样品的力学性能比聚合物基体提高了4倍。优异的EMI屏蔽和热管理性能，以及简便且易于扩展的生产技术，意味着该聚合物复合材料在下一代智能电子设备中具有广阔的前景。
