Liang Yan, Perumal Veeramalai Chandrasekar, Lin Guochen, Su Xiangbin, Zhang Xiaoming, Feng Shuai, Xu Yingqiang, Li Chuanbo
School of Science, Minzu University of China, Beijing 100081, People's Republic of China.
Optoelectronics Research Center, Minzu University of China, Beijing 100081, People's Republic of China.
Nanotechnology. 2022 Mar 9;33(22). doi: 10.1088/1361-6528/ac5442.
The on-chip avalanche photodiodes (APDs) are crucial component of a fully integrated photonics system. Specifically, III-V compound APD has become one of the main applications of optical fiber communication reception due to adaptable bandgap and low noise characteristics. The advancement of structural design and material choice has emerged as a means to improve the performance of APDs. Therefore, it is inevitable to review the evolution and recent developments on III-V compound APDs to understand the current progress in this field. To begin with, the basic working principle of APDs are presented. Next, the structure development of APDs is briefly reviewed, and the subsequent progression of III-V compound APDs (InGaAs APDs, AlInAsSbAPDs) is introduced. Finally, we also discuss the key issues and prospects of AlInAsSbdigital alloy avalanche APDs that need to be addressed for the future development of ≥2m optical communication field.
片上雪崩光电二极管(APD)是全集成光子系统的关键组件。具体而言,III-V族化合物APD因其可适应的带隙和低噪声特性,已成为光纤通信接收的主要应用之一。结构设计和材料选择的进步已成为提高APD性能的一种手段。因此,回顾III-V族化合物APD的发展历程和最新进展,以了解该领域的当前进展是不可避免的。首先,介绍了APD的基本工作原理。接下来,简要回顾了APD的结构发展,并介绍了III-V族化合物APD(InGaAs APD、AlInAsSb APD)的后续进展。最后,我们还讨论了AlInAsSb数字合金雪崩APD在≥2μm光通信领域未来发展中需要解决的关键问题和前景。