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采用熔融长丝制造（FFF）3D打印技术制备聚乳酸/聚己内酯/石墨烯纳米片（GNP）导电电路

Fabrication of PLA/PCL/Graphene Nanoplatelet (GNP) Electrically Conductive Circuit Using the Fused Filament Fabrication (FFF) 3D Printing Technique.

作者信息

Masarra Nour-Alhoda, Batistella Marcos, Quantin Jean-Christophe, Regazzi Arnaud, Pucci Monica Francesca, El Hage Roland, Lopez-Cuesta José-Marie

机构信息

Polymers Composites and Hybrids (PCH), IMT Mines Ales, 30100 Ales, France.

LMGC, IMT Mines Ales, Université Montpellier, CNRS, 30100 Ales, France.

出版信息

Materials (Basel). 2022 Jan 20;15(3):762. doi: 10.3390/ma15030762.

DOI:10.3390/ma15030762
PMID:35160709
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8836401/
Abstract

For the purpose of fabricating electrically conductive composites via the fused filament fabrication (FFF) technique whose properties were compared with injection-moulded properties, poly(lactic acid) (PLA) and polycaprolactone (PCL) were mixed with different contents of graphene nanoplatelets (GNP). The wettability, morphological, rheological, thermal, mechanical, and electrical properties of the 3D-printed samples were investigated. The microstructural images showed the selective localization of the GNPs in the PCL nodules that are dispersed in the PLA phase. The electrical resistivity results using the four-probes method revealed that the injection-moulded samples are insulators, whereas the 3D-printed samples featuring the same graphene content are semiconductors. Varying the printing raster angles also exerted an influence on the electrical conductivity results. The electrical percolation threshold was found to be lower than 15 wt.%, whereas the rheological percolation threshold was found to be lower than 10 wt.%. Furthermore, the 20 wt.% and 25 wt.% GNP composites were able to connect an electrical circuit. An increase in the Young's modulus was shown with the percentage of graphene. As a result, this work exhibited the potential of the FFF technique to fabricate biodegradable electrically conductive PLA-PCL-GNP composites that can be applicable in the electronic domain.

摘要

为了通过熔丝制造（FFF）技术制造导电复合材料，并将其性能与注塑成型性能进行比较，将聚乳酸（PLA）和聚己内酯（PCL）与不同含量的石墨烯纳米片（GNP）混合。研究了3D打印样品的润湿性、形态、流变学、热学、力学和电学性能。微观结构图像显示了GNP在分散于PLA相中的PCL结节中的选择性定位。使用四探针法的电阻率结果表明，注塑成型样品是绝缘体，而具有相同石墨烯含量的3D打印样品是半导体。改变打印光栅角度也会对电导率结果产生影响。发现电渗流阈值低于15 wt.%，而流变渗流阈值低于10 wt.%。此外，20 wt.%和25 wt.%的GNP复合材料能够连接电路。杨氏模量随石墨烯百分比的增加而增加。因此，这项工作展示了FFF技术制造可应用于电子领域的可生物降解导电PLA-PCL-GNP复合材料的潜力。

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