Zhang Yali, Ma Zhonglei, Ruan Kunpeng, Gu Junwei
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China.
Research (Wash D C). 2022 Feb 2;2022:9780290. doi: 10.34133/2022/9780290. eCollection 2022.
Multifunctional electromagnetic interference (EMI) shielding materials would solve electromagnetic radiation and pollution problems from electronic devices. Herein, the directional freeze-drying technology is utilized to prepare the aramid nanofiber/polyvinyl alcohol aerogel with a directionally porous structure (D-ANF/PVA), and the TiCT dispersion is fully immersed into the D-ANF/PVA aerogel ultrasonication and vacuum-assisted impregnation. TiCT /(ANF/PVA) EMI shielding composite films with directionally ordered structure (D-TiCT /(ANF/PVA)) are then prepared by freeze-drying and hot pressing. Constructing a directionally porous structure enables the highly conductive TiCT nanosheets to be wrapped on the directionally porous D-ANF/PVA framework in order arrangement and overlapped with each other. And the hot pressing process effectively reduces the layer spacing between the stacked wavy D-ANF/PVA, to form a large number of TiCT -TiCT continuous conductive paths, which significantly improves the conductivity of the D-TiCT /(ANF/PVA) EMI shielding composite film. When the amount of TiCT is 80 wt%, the EMI shielding effectiveness (EMI SE) and specific SE (SSE/) of D-TiCT /(ANF/PVA) EMI shielding composite film achieve 70 dB and 13790 dB·cm·g (thickness and density of 120 m and 0.423 g·cm), far superior to random-structured TiCT /(ANF/PVA) (R-TiCT /(ANF/PVA)) composite film (46 dB and 9062 dB·cm·g, respectively) blending-freeze-drying followed by hot pressing technology. Meanwhile, the D-TiCT /(ANF/PVA) EMI shielding composite film possesses excellent flexibility and foldability.
多功能电磁干扰(EMI)屏蔽材料将解决电子设备产生的电磁辐射和污染问题。在此,利用定向冷冻干燥技术制备具有定向多孔结构的芳纶纳米纤维/聚乙烯醇气凝胶(D-ANF/PVA),并通过超声和真空辅助浸渍将TiCT分散体完全浸入D-ANF/PVA气凝胶中。然后通过冷冻干燥和热压制备具有定向有序结构的TiCT /(ANF/PVA) EMI屏蔽复合膜(D-TiCT /(ANF/PVA))。构建定向多孔结构可使高导电性的TiCT纳米片有序排列地包裹在定向多孔的D-ANF/PVA骨架上并相互重叠。并且热压过程有效地减小了堆叠的波浪状D-ANF/PVA之间的层间距,形成大量TiCT -TiCT连续导电路径,这显著提高了D-TiCT /(ANF/PVA) EMI屏蔽复合膜的导电性。当TiCT的含量为80 wt%时,D-TiCT /(ANF/PVA) EMI屏蔽复合膜的电磁干扰屏蔽效能(EMI SE)和比屏蔽效能(SSE/)分别达到70 dB和13790 dB·cm·g(厚度和密度分别为120 m和0.423 g·cm),远优于采用共混冷冻干燥后热压技术制备的随机结构TiCT /(ANF/PVA)(R-TiCT /(ANF/PVA))复合膜(分别为46 dB和9062 dB·cm·g)。同时,D-TiCT /(ANF/PVA) EMI屏蔽复合膜具有优异的柔韧性和可折叠性。