Bo Lin, Li Fujin, Hou Yangbo, Zuo Min, Zhao Degang
School of Materials Science and Engineering, University of Jinan, Jinan 250022, China.
Heze Institute of Product Inspection and Testing, Heze 274000, China.
Nanomaterials (Basel). 2022 Feb 14;12(4):640. doi: 10.3390/nano12040640.
Forming co-alloying solid solutions has long been considered as an effective strategy for improving thermoelectric performance. Herein, the dense Cu(MnFeNi)Se ( = 0-0.09) with intrinsically low thermal conductivity was prepared by a melting-ball milling-hot pressing process. The influences of nanostructure and compositional gradient on the microstructure and thermoelectric properties of CuSe were evaluated. It was found that the thermal conductivity decreased from 1.54 WmK to 0.64 WmK at 300 K via the phonon scattering mechanisms caused by atomic disorder and nano defects. The maximum value for the Cu(MnFeNi)Se sample was 1.08 at 750 K, which was about 27% higher than that of a pristine sample.
长期以来，形成共合金固溶体一直被认为是提高热电性能的有效策略。在此，通过熔融球磨-热压工艺制备了具有固有低热导率的致密Cu(MnFeNi)Se（= 0 - 0.09）。评估了纳米结构和成分梯度对CuSe微观结构和热电性能的影响。研究发现，在300 K时，由于原子无序和纳米缺陷引起的声子散射机制，热导率从1.54 W/(m·K)降至0.64 W/(m·K)。Cu(MnFeNi)Se样品在750 K时的最大ZT值为1.08，比原始样品高出约27%。
