Garagnani David, De Padova Paola, Ottaviani Carlo, Quaresima Claudio, Generosi Amanda, Paci Barbara, Olivieri Bruno, Jałochowski Mieczysław, Krawiec Mariusz
Consiglio Nazionale delle Ricerche-ISM, Via Fosso del Cavaliere 100, 00133 Roma, Italy.
Instituto Nazionale di Fisica Nucleare-Laboratori Nazionali di Frascati-INFN-LNF, Via Enrico Fermi 54, 00044 Frascati, Italy.
Materials (Basel). 2022 Feb 25;15(5):1730. doi: 10.3390/ma15051730.
One-monolayer (ML) (thin) and 5-ML (thick) Si films were grown on the α-phase Si(111)√3 × √3R30°-Bi at a low substrate temperature of 200 °C. Si films have been studied in situ by reflection electron energy loss spectroscopy (REELS) and Auger electron spectroscopy, as a function of the electron beam incidence angle α and low-energy electron diffraction (LEED), as well as ex situ by grazing incidence X-ray diffraction (GIXRD). Scanning tunneling microscopy (STM), and scanning tunneling spectroscopy (STS) were also reported. The REELS spectra, taken at the Si K absorption edge (~1.840 KeV), reveal the presence of two distinct loss structures attributed to transitions 1→π* and 1→σ* according to their intensity dependence on α, attesting to the -like hybridization of the silicon valence orbitals in both thin and thick Si films. The synthesis of a silicon allotrope on the α-phase of Si(111)√3 × √3R30°-Bi substrate was demonstrated by LEED patterns and GIXRD that discloses the presence of a Si stack of 3.099 (3) Å and a √3 × √3 unit cell of 6.474 Å, typically seen for multilayer silicene. STM and STS measurements corroborated the findings. These measurements provided a platform for the new √3 × √3R30° Si allotrope on a Si(111)√3 × √3 R30°-Bi template, paving the way for realizing topological insulator heterostructures from different two-dimensional materials, Bi and Si.
在200℃的低衬底温度下,在α相Si(111)√3×√3R30°-Bi上生长了单层(薄)和5层(厚)的硅膜。通过反射电子能量损失谱(REELS)和俄歇电子能谱对硅膜进行了原位研究,研究内容包括电子束入射角α和低能电子衍射(LEED)的函数关系,同时还通过掠入射X射线衍射(GIXRD)进行了非原位研究。此外还报道了扫描隧道显微镜(STM)和扫描隧道谱(STS)。在硅K吸收边(~1.840 KeV)处采集的REELS光谱显示,根据其对α的强度依赖性,存在两种不同的损失结构,分别归因于1→π和1→σ跃迁,这证明了薄硅膜和厚硅膜中硅价轨道的类sp²杂化。通过LEED图案和GIXRD证明了在Si(111)√3×√3R30°-Bi衬底的α相上合成了一种硅同素异形体,其揭示了存在3.099(3)Å的硅堆叠和6.474 Å的√3×√3晶胞,这是多层硅烯中常见的结构。STM和STS测量结果证实了这些发现。这些测量为在Si(111)√3×√3 R30°-Bi模板上制备新型√3×√3R30°硅同素异形体提供了一个平台,为实现由不同二维材料Bi和Si组成的拓扑绝缘体异质结构铺平了道路。