Cao Haiyao, Zhan Zaiji, Lv Xiangzhe
State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China.
Materials (Basel). 2022 Mar 1;15(5):1846. doi: 10.3390/ma15051846.
TiAlC presents a hexagonal layered crystal structure and bridges the gap between metallic and ceramic properties, and Gadolinia (GdO) has excellent thermodynamic stability, which make them potentially attractive as dispersive phases for Cu matrix composites. In this paper, Cu@TiAlC-GdO/Cu composites, TiAlC-GdO/Cu composites, and GdO/Cu composites were prepared by electroless Cu plating, internal oxidation, and vacuum hot press sintering. The microstructure and the effect of the Cu plating on the properties of the Cu@TiAlC-GdO/Cu composites were discussed. The results showed that a Cu plating with a thickness of about 0.67 μm was successfully plated onto the surface of TiAlC particles. The ex situ TiAlC particles were distributed at the Cu grain boundary, while the in situ GdO particles with a grain size of 20 nm were dispersed in the Cu grains. The electroless Cu plating onto the surface of the TiAlC particles effectively reduces their surfactivity and improves the surface contacting state between the Cu@TiAlC particles and the Cu matrix, and reduces electron scattering, so that the tensile strength reached 378.9 MPa, meanwhile, the electrical conductivity and elongation of the Cu matrix composites was maintained at 93.6 IACS% and 17.6%.
TiAlC具有六方层状晶体结构，兼具金属和陶瓷性能，而氧化钆（GdO）具有优异的热力学稳定性，这使得它们作为铜基复合材料的分散相具有潜在吸引力。本文通过化学镀铜、内氧化和真空热压烧结制备了Cu@TiAlC-GdO/Cu复合材料、TiAlC-GdO/Cu复合材料和GdO/Cu复合材料。讨论了Cu@TiAlC-GdO/Cu复合材料的微观结构以及镀铜对其性能的影响。结果表明，成功在TiAlC颗粒表面镀上了厚度约为0.67μm的铜镀层。异位TiAlC颗粒分布在铜晶界处，而原位生成的粒径为20nm的GdO颗粒分散在铜晶粒中。在TiAlC颗粒表面进行化学镀铜有效降低了其表面活性，改善了Cu@TiAlC颗粒与铜基体之间的表面接触状态，并减少了电子散射，使得拉伸强度达到378.9MPa，同时，铜基复合材料的电导率和伸长率分别保持在93.6%IACS和17.6%。
