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金属-绝缘体界面相互作用对颗粒金属中电输运的影响。

The effect of metal-insulator interface interactions on electrical transport in granular metals.

作者信息

Gilbert Simeon J, Rosenberg Samantha G, Kotula Paul G, Kmieciak Thomas G, Biedermann Laura B, Siegal Michael P

机构信息

Sandia National Laboratories, Albuquerque, NM 87185, United States of America.

Department of Physics, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States of America.

出版信息

J Phys Condens Matter. 2022 Mar 14;34(20). doi: 10.1088/1361-648X/ac5706.

DOI:10.1088/1361-648X/ac5706
PMID:35289307
Abstract

We present an in-depth study of metal-insulator interfaces within granular metal (GM) films and correlate their interfacial interactions with structural and electrical transport properties. Nominally 100 nm thick GM films of Co and Mo dispersed within yttria-stabilized zirconia (YSZ), with volumetric metal fractions () from 0.2-0.8, were grown by radio frequency co-sputtering from individual metal and YSZ targets. Scanning transmission electron microscopy and DC transport measurements find that the resulting metal islands are well-defined with 1.7-2.6 nm average diameters and percolation thresholds between= 0.4-0.5. The room temperature conductivities for the= 0.2 samples are several orders of magnitude larger than previously-reported for GMs. X-ray photoemission spectroscopy indicates both oxygen vacancy formation within the YSZ and band-bending at metal-insulator interfaces. The higher-than-predicted conductivity is largely attributed to these interface interactions. In agreement with recent theory, interactions that reduce the change in conductivity across the metal-insulator interface are seen to prevent sharp conductivity drops when the metal concentration decreases below the percolation threshold. These interface interactions help interpret the broad range of conductivities reported throughout the literature and can be used to tune the conductivities of future GMs.

摘要

我们对颗粒金属(GM)薄膜中的金属-绝缘体界面进行了深入研究,并将其界面相互作用与结构和电输运性质相关联。通过射频共溅射从单个金属靶和氧化钇稳定氧化锆(YSZ)靶生长出名义厚度为100nm的Co和Mo分散在YSZ中的GM薄膜,其体积金属分数()为0.2 - 0.8。扫描透射电子显微镜和直流输运测量发现,所形成的金属岛定义明确,平均直径为1.7 - 2.6nm,渗流阈值在 = 0.4 - 0.5之间。对于 = 0.2的样品,室温电导率比先前报道的GM薄膜高几个数量级。X射线光电子能谱表明YSZ内形成了氧空位,并且在金属-绝缘体界面处发生了能带弯曲。高于预期的电导率很大程度上归因于这些界面相互作用。与最近的理论一致,当金属浓度降低到渗流阈值以下时,减少金属-绝缘体界面处电导率变化的相互作用可防止电导率急剧下降。这些界面相互作用有助于解释文献中报道的广泛电导率范围,并可用于调节未来GM薄膜的电导率。

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