Liang Peijie, Pan Zhiliang, Tang Liang, Zhang Guoqi, Yang Daoguo, He Siliang, Yan Haidong
Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.
Delft Institute of Microsystems and Nanoelectronics (Dimes), Delft University of Technology, Mekelweg 6, 2628 CD Delft, The Netherlands.
Materials (Basel). 2022 Mar 17;15(6):2232. doi: 10.3390/ma15062232.
Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.
基于分子动力学（MD），本研究通过随机算法建立了一个模型来模拟银浆的初始涂层形态，并分析了不同尺寸颗粒对烧结孔隙率的影响。分子动力学结果表明，与使用大尺寸银颗粒的烧结过程相比，在相同烧结条件下，使用多尺度银颗粒的烧结过程会提高致密化程度，这在理论上验证了在大尺寸银颗粒中添加小银颗粒的可行性。此外，为进一步验证多尺度烧结的可行性，对使用微纳多尺度银浆的烧结实验进行了半原位观察。通过理论和实验手段证明了多尺度银烧结的可行性，这可为优化烧结工艺以及为电力电子行业的芯片附着制备银浆提供有意义的参考。此外，希望未来能在此基础上取得更好的进展。
